Circuit World: Volume 42 Issue 1

Printed HF antennas for RFID on-metal transponders

Kamil Janeczek, Aneta Arazna, Bartłomiej Salski, Krzysztof Lipiec, Małgorzata Jakubowska

The purpose of this paper is to investigate screen-printed high-frequency (HF) antennas for radio frequency identification (RFID) on-metal transponders in which a magnetic sheet…

Surface analysis of polymeric substrates used for inkjet printing technology

Alena Pietrikova, Peter Lukacs, Dagmar Jakubeczyova, Beata Ballokova, Jerzy Potencki, Grzegorz Tomaszewski, Jan Pekarek, Katerina Prikrylova, Martin Fides

This paper aims to find an optimal surface treatment of commonly used polymeric substrates for achieve the high adhesion of printed structures. For this reason, the investigation…

Embedding components in voltage converter PCB for size reduction and heat management

Mariusz Wojcik, Dariusz Witek, Tomasz Klej, Edward Ramotowski

The purpose of this paper was to show physical limitation of embedding standard packaging components into printed circuit board (PCB) which is more reasonable technology for small…

Application of direct bonded copper substrates for prototyping of power electronic modules

Wojciech Grzesiak, Piotr Maćków, Tomasz Maj, Beata Synkiewicz, Krzysztof Witek, Ryszard Kisiel, Marcin Myśliwiec, Janusz Borecki, Tomasz Serzysko, Marek Żupnik

This paper aims to present certain issues in direct bonded copper (DBC) technology towards the manufacture of Al2O3 or AlN ceramic substrates with one or both sides clad with a…

Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

Michal Baszynski, Edward Ramotowski, Dariusz Ostaszewski, Tomasz Klej, Mariusz Wojcik, Mikko Kohvakka, Anssi Kamari

– The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies.

Thermal properties of modified carbon films

Jerzy Kalenik, Konrad Kielbasinski, Piotr Firek, Elżbieta Czerwosz, Jan Szmidt

– The purpose of this paper is to present thermal properties of palladium-carbon films prepared by physical vapour deposition (PVD)/chemical vapour deposition (CVD) methods.

Recent progress in direct exposure of interconnects on PCBs

Robert Barbucha, Jerzy Mizeraczyk

This paper aims to use a survey of techniques to present the patterning of electric circuitry on printed circuit boards (PCBs). Second, a proposal of a new technology for direct…

IMAPS 2015 Poland

Agata Skwarek