Circuit World: Volume 44 Issue 1

Guest editorial

Agata Skwarek

Technological aspects of silver particle sintering for electronic packaging

Jan Felba

This paper aims to find proper technological parameters of low-temperature joining technique by silver sintering to eventually use this technique for reliable electronic packaging.

Thermal interface materials based on graphene and silver nanopowder

Piotr Sobik, Radoslaw Pawlowski, Bartlomiej Pawlowski, Boguslaw Drabczyk, Kazimierz Drabczyk

The purpose of this paper is to present results of the studies on modification of ethylene-vinyl acetate (EVA) encapsulation foil to be used as thermal interface material (TIM)…

Packing density of inkjet printed paths

Grzegorz Tomaszewski, Jerzy Potencki, Tadeusz Wałach

This paper aims to study the packing density of printed paths on different substrate materials. It presents problems which appear when the necessity of printing one or more narrow…

Thermal stability analysis of passive components embedded into printed circuit boards

Wojciech Stęplewski, Andrzej Dziedzic, Kamil Janeczek, Aneta Araźna, Krzysztof Lipiec, Janusz Borecki, Tomasz Serzysko

The purpose of this paper is to investigate the behavior of embedded passives under changing temperature conditions. Influence of different temperature changes on the basic…

Solder joint quality evaluation based on heating factor

Petr Veselý, Eva Horynová, Jiří Starý, David Bušek, Karel Dušek, Vít Zahradník, Martin Plaček, Pavel Mach, Martin Kučírek, Vladimír Ježek, Milan Dosedla

The purpose of this paper is to increase the reliability of manufactured electronics and to reveal reliability significant factors. The experiments were focused especially on the…

ISFET structures with chemically modified membrane for bovine serum albumin detection

Piotr Firek, Michal Cichomski, Michal Waskiewicz, Ireneusz Piwoński, Aneta Kisielewska

The purpose of this paper is to present possibility of fast and certain identification of bovine serum albumin (BSA) by means of ion-sensitive field effect transistor (ISFET…