Table of contents
Editorial
DAVID BOSWELL, LORNA CULLENComponents for surface mounting are asked to withstand much harsher treatment than their conventional brethren and many of their makers have performed miracles in achieving…
Displacement of Components and Solder during Reflow Soldering
R.J. Klein Wassink, J.A.H. van GervenDuring reflow soldering the applied solder paste is melted and the components, previously placed on the solder paste, move into their final position. This process, however, may be…
Critical Parameters of Measurement Using the Wetting Balance
J. BarrangerThe accuracy of severability measurements using the wetting balance depends on a number of parameters, some of which will be studied and discussed. Particular attention will be…
Surface Mount Solder Joint Long‐term Reliability: Design, Testing, Prediction
W. EngelmaierIn this paper an overview of the issues underlying surface mount solder joint long‐term reliability is presented. The paper gives state‐of‐the‐art solutions for ‘Design for…
Heat Transfer Fluids for Vapour Phase Soldering — An Appraisal
C. LeaThe success of vapour phase soldering for electronic assemblies has led to the availability of several heat transfer fluids for the purpose. This paper aims to demonstrate the…
Effect of Natural Ageing on the Mechanical Properties of the Soldered Joint Used in the Electronics Industry
S.S. AhluwaliaJoints made to the Surface Mount configuration for a chip capacitor using either 60Sn40Pb or 62Sn36Pb2Ag solders were found to weaken substantially during storage at room…
How to Use Automated X‐ray Inspection for Process Monitoring and Control
R. NamethThe initial excitement over increased solder joint densities, higher manufacturing throughput, and superior electrical performance brought forth by surface mount technology (SMT…
The Strength of Soldered Joints on Surface Mounted Devices
E.E. de Kluizenaar, M.M.F. VerguldStrength measurements of soldered joints in electronics are widely used for the assessment of joint quality. However, a variety of experiments, reported in this article, clearly…
Surface Mount Technology Trade and Professional Associations
C. LeaA brief review is presented of the aims and activities of the trade and professional associations that offer a participation in the advancement of surface mount technology…
International Tin Research Institute, Uxbridge, Middlesex
B.N. EllisThe ITRI is well known in the soldering field for its technical contributions to industry, in the form of papers presented at conferences, slide sets and its own publications…
Special reports
R.B. Turnbull, Colin Lea, Richard DenmanBryan Pledger, Chairman of the IMF Printed Circuit Group, chaired this meeting, held in London on 26 September, and introduced the panel of speakers, well‐known nationally and…
Industry news
Multicore Solders Ltd have appointed Richard Hart (38) as marketing manager. Prior to accepting his new position, Mr Hart was responsible for marketing at DEK where his career…
New Products
Heraeus of Hanau, W. Germany, have introduced a new solder paste (Series SC 3300), designed for SM technology. Heraprint and Cermalloy solder paste formulations eliminate the…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang