Table of contents
Numerical modelling of solder joint formation
Chris Bailey, Daniel Wheeler, Mark CrossSolder materials are used to provide a connection between electronic components and printed circuit boards (PCBs) using either the reflow or wave soldering process. As a board…
The beneficial effect of underfilling on the reliability of flip‐chip joints
Bela RoesnerRecently several low‐cost alternatives for flip‐chip interconnection technology have been investigated. The scope of this paper is a reliability study of flip‐chip assemblies on…
The criticality of component forming and tinning in a high‐reliability low‐volume facility
David L. Cusick, William F. Knight, Bob MadeirosDealing with forming and tinning in a low‐volume high‐reliability environment is a never‐ending challenge. This process is one of the most critical steps in SMT fabrication. The…
Engineering solder paste performance through controlled stress rheology analysis
Xiaohua Bao, Ning‐Cheng Lee, Rajkumar B. Raj, K.P. Rangan, Anu MariaThe rheology of solder paste significantly affects the qualities of stencil printing, tack and slump performance. This paper describes a series of tests performed on solder paste…
Erratum
This article has been withdrawn as it was published elsewhere and accidentally duplicated. The original article can be seen here: 10.1108/09576069610125094. When citing the…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang