Table of contents
Pb‐free solder bumping for flip chip package by electroplating
Hyeon Hwang, Soon‐Min Hong, Jae‐Pil Jung, Choon‐Sik KangSn‐Pb and Sn‐Ag bumps (130 μm diameter, 250 μm pitch) made using an electroplating process were studied. As a preliminary experiment, the effects of current density and plating…
Interaction kinetics between PBGA solder balls and Au/Ni/Cu metallisation during laser reflow bumping
Yanhong Tian, Chunqing Wang, Xiaodong Zhang, Deming LiuIn this paper, the interaction kinetics between eutectic PbSn solder and Au/Ni/Cu metallisation of plastic ball grid array packages during laser reflow bumping were investigated…
Process characterization of PCB assembly using 0201 packages with lead‐free solder
David Geiger, Fredrik Mattsson, Dongkai Shangguan, MT Ong, Patrick Wong, Mei Wang, Todd Castello, Sammy Yi0201 assembly plays a very important role in the continuing miniaturization of electronics products. After a systematic study using Sn‐Pb solder paste on pad design, machine…
The effect of the hot air levelling process on skip solder defects in the wave soldering process
Teo Kiat ChoonIt was observed that “no solder” or “skipped solder” defects occurred on a particular printed circuit board assembly product during wave soldering. Investigations were carried out…
A novel measurement technique for stencil printed solder paste
Milosˇ Dusˇek, Christopher HuntThe printing process is the most critical step in surface mount assembly. To control and monitor printing, complex instrumentation is available for measuring the print…
Study of under bump metallisation barrier layer for lead‐free solder
K.C. Chan, Z.W. Zhong, K.W. OngThe elimination of lead from solders for flip‐chip attachment has necessitated many new studies on the reliability of the resultant systems. There are many lead‐free solder…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang