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Soldering & Surface Mount Technology: Volume 16 Issue 1

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Table of contents

Design for lead‐free solder joint reliability of high‐density packages

John Lau, Walter Dauksher, Joe Smetana, Rob Horsley, Dongkai Shangguan, Todd Castello, Irv Menis, Dave Love, Bob Sullivan

The lead‐free solder joint reliability of several printed circuit board mounted high‐density packages, when subjected to temperature cycling was investigated by finite element…

714

Reflow profile study of the Sn‐Ag‐Cu solder

B. Salam, C. Virseda, H. Da, N.N. Ekere, R. Durairaj

A study of the Sn‐Ag‐Cu lead‐free solder reflow profile has been conducted. The purpose of the work was to determine the Sn‐Ag‐Cu reflow profile that produced solder bumps with a…

1110

Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings

Minna Arra, Todd Castello, Dongkai Shangguan, Eero Ristolainen

The mechanical properties of Sn/Ag/Cu solder joints in combination with different component lead coating materials (Ni/Pd/Au, Sn/15 per cent Pb, Sn/2 per cent Bi, and Sn) are…

682

The effect of lead‐free solder paste on component placement accuracy and self‐alignment during reflow

Timo Liukkonen, Pekka Nummenpää, Aulis Tuominen

The electronics industry will implement lead‐free soldering in the near future. Lead‐free implementation steps are divided into lead‐free process and lead‐free product. The…

516

Thermal fatigue cracking of surface mount conductive adhesive joints

Zhimin Mo, Zonghe Lai, Shiming Li, Johan Liu

Electrically conductive adhesives are considered to be strong candidates for replacing toxic lead‐based solders. The present work has focused on thermal fatigue cracking of…

652

Design, materials and process for lead‐free assembly of high‐density packages

Joe Smetana, Rob Horsley, John Lau, Ken Snowdon, Dongkai Shangguan, Jerry Gleason, Irv Memis, Dave Love, Walter Dauksher, Bob Sullivan

The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high‐density packages using lead‐free solder. The design, material, and…

704

Fisnar benchtop dispenser is feature-packed at low cost

35

The 7th VLSI Packaging Workshop of Japan 30 November-2 December 2004

179

Universal Instruments appoints distributor for United Kingdom

38

AIM opens office in Suzhou, China

43

Greener conformal coating aerosol from Concoat

50

DEK’s technology for the ePrinter age

42

Nanomix and DuPont Electronic Technologies sign exclusive licensing agreement for the use of carbon nanotubes in field emission displays

41

Siemens Dimatic places new Siplace managers in Asia

46

HawkEye: a new breed of automatic print verification

38

Burr and stress free precision components by chemical techniques

55

NPL releases stencil and aperture design report

37

Small reflow oven for lead-free SMT

126

The SMART Group lead-free assembly and soldering workshop

John Ling

38

DEK steps into the future with Galaxy

43

Universal appoints distributor for German territories

27

Understanding Automotive Electronics

39

Asymtek/Nordson appoints Smart Technology (SmartTec) as new distributor in Europe

57

Bebop to the Boolean Boogie

38

DuPont Microcircuit Materials announces commercially available thick film material system for aluminum nitride

131

Highly versatile optical inspection system produces outstanding results on large boards measuring up to 914 × 914 mm

47

International diary

39

Introducing the APR-5000-XLS array package rework system: Metcal makes its innovative rework system bigger and better

94

Autosplice expands SMiT shield clip family with introduction of the maxi-clip for handling larger, thicker RF shields

60

SMART Group AOI seminar at Haldex Brakes, Redditch

43

Concoat introduce the latest MUST System II Plus solderability tester for analysing the smallest surface mount devices

76

Siemens Dematic unveils Siplace HF/3 placement machine at Productronica

63

Celestica’s kidsgrove facility accredited to medical devices standard ISO13488:1996 and compliant to ISO13485:2003

116

TBA launch latest range of test instrumentation

73

Message from the Associate Editor

John Ling

211

DEK rewarded by Frost and Sullivan

37

New studies will uncover mechanisms of protection for electronic conformal coatings

46

New mass imaging process enhances TIM at a stroke

43

New Horizon 03 (ELA) featured for convenience and rapid changeovers

34

Electrolube dances to the Samba beat

36

Ion chromatography available at NPL, £30K invested

52

ProFlex™ heralds high throughput printing at ultra-fine resolution

41

Speedprint launches new 29 in. large area printer

35

Internet commentary

Brian Ellis

55

Asymtek launches new high-speed DispenseJet® DJ-9000Jet

43

Universal Instruments and Heraeus join forces to share knowledge with customers

34

DEK launches stencil renaissance with VectorGuard™ at Productronica 2003

48

Asymtek’s new SC-300 Swirl Coat™ applicator features three modes of operation for flexibility and control

74

Productronica 2003

John Ling

55

Chip Scale Packaging for Modern Electronics

46

Universal announces new management appointments

39

Interactive Guide to Flexible Circuit Technology

40

New Europlacer product – a flexible "all in one" placement solution

106

Area Array Packaging Handbook

128

DEK enhances stencil manufacturing capabilities and installs Next Generation Inspection System

45

Exhibitions and conferences

157

New Advantis™ raises entry-level performance, reduces cost-per-placement

45

SMTA and Asymtek partner at first inaugural meeting of SMTA, Costa Rica

43

Ready for lead-free

41

Tombstoning is laid to rest!

40

SMART Group Web site and PPM-monitoring updates

46

New range of static-safe desoldering guns from TBA ECP

27

New potting compound for RF circuits

338

Note from the publisher

John Peters

179

Karl Seelig of AIM honoured with IPC President’s Award

37
Cover of Soldering & Surface Mount Technology

ISSN:

0954-0911

Online date, start – end:

1989

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editors:

  • Professor Peng He
  • Associate Professor Shuye Zhang

Further Information

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