Table of contents
Effects of thermal history on the intermetallic growth and mechanical strength of Pb‐free and Sn‐Pb BGA solder balls
J. Liang, N. Dariavach, P. Callahan, D. ShangguanTo investigate effects of the thermal history on intermetallic thickness and morphology and on the resulting shear strength of the ball attachment for a variety of BGA components.
875
Optimization of lead free solder 01005 component assembly
Yueli Liu, R. Wayne JohnsonTo optimize the printed circuit board design and assembly processes to minimize defects in the assembly of 01005 size chip resistors.
1066
Optimization of a reflow soldering process based on the heating factor
JinGang Gao, YiPing Wu, Han DingThis paper aims to establish a method to optimize reflow profiles and achieve high reliability of solder joints on the basis of the heating factor, Qη, a measure of the reflow…
742
Process and pad design optimization for 01005 passive component surface mount assembly
Yu Wang, Michael Olorunyomi, Martin Dahlberg, Zoran Djurovic, Johan Anderson, Johan LiuThe ever present need for the miniaturization of electronic assemblies has driven the size of passive components to as small as the 01005 package size. However, the packaging…
623
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang