Table of contents
Dissolution of copper on Sn‐Ag‐Cu system lead free solder
Goro Izuta, Tsuyoshi Tanabe, Katsuaki SuganumaThe paper's purpose is to provide a solution to a problem on dissolution and disappearance of copper electrodes in solder bath in lead free soldering on printed circuit board…
600
Strain range fatigue life assessment of lead‐free solder interconnects subject to temperature cycle loading
Michael Osterman, Michael PechtThe aim is to present temperature fatigue model constants for lead‐free tin‐silver‐copper solder derived from test data and demonstrate the validity of the model using published…
712
Global environmental impact assessment of the Pb‐free shift
Anders S.G. Andrae, Norihiro Itsubo, Atsushi InabaUsing two different conceptual approaches to environmental life‐cycle assessment, attributional and consequential, the purpose was to test the hypothesis that a typical lead free…
12540
High‐cycle fatigue testing of Pb‐free solder joints
N. Barry, I.P. Jones, T. Hirst, I.M. Fox, J. RobinsThe research aims to explore the high‐cycle fatigue performance of Pb‐free alloys and compare them to Sn‐Pb. In doing this, it also aims to demonstrate the viability of a new…
748
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang