Table of contents
Surface mount technology in the U.S. as viewed by a surface mount council member
GARY G. PETERSENAs guest editor, I was asked to view Surface Mount Technology (SMT) in the U.S. through the eyes of a member of the Surface Mount Council. As such, my observations are interwoven…
Contaminant Particles in Electronic Solder Fluxes
M.A. Nasta, G.R. Hill, D. CampbellThe filterable particles found in electronic solder fluxes vary considerably in both concentration and chemistry. Four fluxes from three manufacturers were examined, including…
Quantitative Solderability Measurement of Electronic Components: Part 1: The Wetting Balance
C. LeaThe subject of the quantitative measurement of solderability of electronic components is introduced. The wetting balance in various configurations and modes of operation is being…
Quantitative Solderability Measurement of Electronic Components: Part 2: An Index of Solderability
C. Lea, W.A. DenchThe wetting balance is used for the measurement of solderability of electronic components. The wetting force is measured dynamically and the technique gives information about both…
Development of a Fluxless Soldering Process for Surface Mount Technology
N. Bandyopadhyay, M. Kirschner, M. MarcziIn the surface mount industry, microelectronic devices are reflow soldered to printed circuit boards with the benefit of mildly activated rosin (RMA) based fluxes. The residues…
Reliability of Soldered Joints: A Description of the State of the Art: Part 1
E.E. de KluizenaarDamage to components during soldering and degradation of soldered joints is determined to a large extent by the mechanical properties and the metallurgy of solder alloys and…
A New Aramid Base Material for Advanced SMT
T. Hirakawa, H. Watanabe, K. NishimuraA new aramid base material for use in laminates to be applied to advanced surface mount technology was developed. A new fibre based on PPDETA (Poly‐p‐phenylene/3,4'‐diphenylether…
Wearout Evaluation of Soldered Interconnections for Surface Mounted Leadless and Leaded Components
J. Seyyedi, S. JawaidThe wearout characteristics were investigated for soldered interconnections of surface mount technology (SMT) chip resistors, chip capacitors and a 44 I/O ceramic leaded chip…
Thermal Characterisation for a Surface Mount Rework System
D.J. SpigarelliEffective control of the rework process for surface mount production rework or for field repair requires a knowledge of the process variables involved in the rework system and of…
SMART group news
Colin LeaSince its early conception, the group has grown from a handful of enthusiastic engineers to the largest trade association in Europe, if not the world, for Surface Mount. As in…
International association news
Colin LeaThe annual Autumn Conference of the British Association for Brazing and Soldering offers a forum for discussions between scientists and engineers involved with two technologies…
Industry news
Alpha Metals, supplier of solders and solder related chemicals, has promoted Mr Stan Renals to the position of Sales and Marketing Manager, reporting to the General Manager…
New Products
Pace Inc. have announced the introduction of their new SMR™‐25 ‘Pulse‐Heat’ SMD Reflow System. Representing a major departure from high‐temperature, continuously heated SMD…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang