Soldering & Surface Mount Technology: Volume 2 Issue 2

Subject:

Table of contents

The Harmfulness of Re‐working Cosmetically Defective Solder Joints

C. Lea

The loss of reliability of a PTH soldered joint caused by unnecessary re‐working after wave soldering is considered. Standardised joints are re‐worked under conditions that…

Stencil Printing of Solder Paste for Fine‐pitch Surface Mount Assembly

J.R. Morris, T. Wojcik

The increasing availability and use of fine pitch integrated circuit packages place increased demands on the stencil printing process for solder paste deposition. To attain the…

Temperature Variations in Soldering and Their Influence on Microstructure and Strength of Solder Joints

M. Nylén, S. Norgren

Since the introduction of surface mounting technology (SMT), interest in solder joints has increased greatly. In this work soldered joints were examined for different kinds of…

Amalgams as Alternative Bonding Materials

C.A. MacKay

Amalgams, which are mechanically alloyed mixes of a liquid metal with a powder, offer advantages in situations where large devices are to be bonded to materials with significant…

Surface Mount Rework—A Review of Techniques and Practice

N. Hunn

The introduction of surface mount technology has changed the approach which is needed for successful rework of components. This has been brought about by the requirement of…

Technical Outline Specification and Guideline for Infra‐red Reflow Soldering

M.T.W. de Langen, M.M.F. Verguld

This paper presents the requirements for infra‐red soldering machines for reflow soldering of printed boards with components for surface mounting. Guidelines for controlling and…

Solder Joint Reliability—Can Solder Creep?

J.S. Hwang, R.M. Vargas

Solder joint long‐term reliability is an ultimate requirement for electronics packaging. Solder joint failure, however, can involve complex mechanisms. One of many basic failure…

Quantitative Solderability Measurement of Electronic Components: Part 3: Surfaces of Standard Solderability

C. Lea

To establish a measurement scale for the solderability of electronic components using the wetting balance, there is a requirement for a set of standard reference surfaces of…

Reliability of Soldered Joints: A Description of the State of the Art: Part 2

E.E. de Kluizenaar

In Part 1, background information on mechanical properties and metallurgy of solder alloys and soldered joints has been presented. In this part, mechanisms of damage and…

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Special reports

Colin Lea

The key environmental issue of the 1980s has been that of the depletion of the stratospheric ozone. The key environmental issue to be addressed in the 1990s will be that of global…

Hollis Automation Inc., Nashua, New Hampshire

B.N. Ellis

Nashua is a city of less than 100,000 souls, but it will remain engraved in this chronicler's memory for as long as he lives. Why? Because he finished his visit to Hollis in the…

Printed Circuit Board Screen Printer with Automatic and Optical Position Correction: DEK Printing Machines, Weymouth, Dorset, England

Ever increasing demands for greater precision with screen printing, especially with solder paste printing for surface mount devices (SMDs), coupled with equally high demands for…

SMART group news

Thirty‐six people attended this SMART Group Seminar at the Bowler Hat Hotel in Birkenhead, Merseyside, on 20 February 1990. The technical programme in the morning comprised five…

International association news

A.C. Chilton

This February meeting began in somewhat dramatic fashion—not with the actor's usual injunction to ’break a leg‘ but with the Chairman's announcement that Stuart Briggs, the fourth…

Industry news

With one eye on the forthcoming Single European Market in 1992, Alpha Metals have appointed Jean H. Lepagnol to the position of Senior Technical Advisor, Europe.

New Products

To meet the new demands placed on solder resist technology, Coates have developed a new two‐pack epoxy solder resist, with a mixed pot life of over 36 hours, which they have named…

Cover of Soldering & Surface Mount Technology

ISSN:

0954-0911

Online date, start – end:

1989

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editors:

  • Professor Peng He
  • Associate Professor Shuye Zhang