Table of contents
Quantitative Solderability Measurement of Electronic Components: Part 4: Wetting Balance Instrument Thermal Design
C. LeaThe wetting balance is being used as the focal point to establish a quantitative measurement capability for solderability of electronic components of all configurations. This…
Closed‐loop Soldering
J.G. DavyThis paper discusses some basic ideas about process development and control in Part I and applies them to soldering in Part II. Because it is possible to understand how design…
Reliability of Soldered Joints: A Description of the State of the Art: Part 3
E.E. de KluizenaarIn Part 1, background information on mechanical properties and metallurgy of solder alloys and soldered joints has been presented. In Part 2, mechanisms of damage and degradation…
A Thermoanalytical Study of the Components and Formulation of a Rosin Based Flux
K. Sherman, C.A. MacKayThermoanalytical spectra of the components of a typical rosin based flux and the interactions of the components with each other, the substrate and the solder are presented. The…
Cycle Life Prediction for SMT Solder Joints on TCE‐Mismatched Substrates
D.E. RiemerA method for the prediction of solder joint cycle life in surface‐mount assemblies is presented, based on the conversion of plastic solder shear strain into cycle life by means of…
Fine Pitch Solder Creams
A.C. Chilton, K.W. GauglerThere is continuous pressure in the electronics industry towards miniaturisation. This has led to the development of fine pitch soldered devices, and this paper considers the…
SMART group news
Colin Lea, C. O MathunaA large group of SMART Group members visited the Henley premises of Electrovert on 9 May. After the welcome and introduction where Mike Judd emphasised Electrovert's commitment to…
International association news
A.C. Chilton, Mark FranckelThe meeting, held on 17 May 1990, was opened promptly by the Chairman Andrew Nicholson, who welcomed everyone to the Seminar and introduced Tony Harman, who gave a very good…
Industry news
W. Goldie, Colin Lea, B.N. EllisAfter 50 years in the electronics industry, Bert Child, Manager of Alpha Metals Ireland, is preparing to hang up his soldering irons and will retire later this year.
New Products
Alpha Metals has developed an entirely new generation of solder pastes to meet the fine line and small lead pitch requirements of up‐to‐date Surface Mount Technology.
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang