Soldering & Surface Mount Technology: Volume 20 Issue 1

Effect of strain on whisker growth in matte tin

To evaluate the role of imposed strain on whisker growth in matte tin, and to identify the appropriate deformation states and environments that will facilitate the development of…

Effect of interconnection area on shear strength of sintered joint with nano‐silver paste

Traditional chip‐level interconnection materials show many weaknesses given the development trend of microelectronic packaging technology. In order to meet the needs of…

Microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue

The purpose of this paper is to investigate the microstructural development of SnAgCu solder joints under different loading conditions (isothermal storage, thermal cycling and…

Effect of Ag content on wetting properties and solidus temperature of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free solders

To study the effect of Ag content on the melting temperature and wetting properties of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free Solders.

PDR announced launch of modular rework system at Productronica 2007

HumiSeal celebrated 50 years with a new water-based coating launch at Productronica 2007

Intertronics get stuck into the Love Truck

Assembléon establishes direct sales and services presence in Germany

Marantz Business Electronics previews new AOI platform at Productronica 2007

SMART power drives Nepcon: Reed Exhibitions and SMART Group announce partnership to jointly manage Nepcon UK

Emerald ex-editor honoured by UN and USA

Contax announces an excellent 2007

The huge impact of printed transistors

IPC certification moves Quantum CAD designers into PCB elite

IeMRC System in Package Workshop

New PS-900 soldering system delivers high power with superior thermal control

Revolutionary new water ingress protection process for electronic devices

Call for papers for China SMT Forum 2008 now open

PhoenixjX-ray presented a variety of new products at Productronica

Novatec continued their tradition of breakthrough technologies at 2007 Productronica

OK International has introduced the MX-PTZ Precision Tweezer hand-piece for the Metcal MX-500 Soldering/Rework System

Exception's “gold standard” Fastrack service

Editorial

SMTA announces their support of SMART Group at Nepcon UK 2008

ASTM declarable substances subcommittee developing proposed tin-based solder alloys standard

Launch of report: XRF Measurement of Residual Materials in Electronics