Table of contents
Effect of Ag content on the microstructure of Sn‐Ag‐Cu based solder alloys
M. Reid, J. Punch, M. Collins, C. RyanThe purpose of this paper is to examine the microstructure and evaluate the intermetallic compounds in the following lead‐free solder alloys: Sn98.5Ag1.0Cu0.5 (SAC105) Sn97.5Ag2.0…
Evaluation of the influence of Bi and Sb additions to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface tension and wetting properties using analysis of variance – ANOVA
K. Bukat, J. Sitek, R. Kisiel, Z. Moser, W. Gasior, M. Kościelski, J. PstruśThe purpose of this paper is a comparable evaluation of the influence of a particular element (Bi and Sb) added to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface and interfacial…
Thermal profiling: a reflow process based on the heating factor
Jin Gang Gao, Yi Ping Wu, Han Ding, Nian Hong WanThis paper aims to offer a convenient method to develop an oven recipe for a specific soldering profile in a reflow process. The method is devised to quickly achieve proper…
Hydrocarbon fluxes for ionic compound free soldering: improvement by peroxide additives
Toshihiro Miyake, Masaru Ishida, Satoshi InagakiThe paper aims to focus on lowering the soldering temperature of ionic compound free soldering using 9,10‐dihydroanthracene as a hydrocarbon flux.
Workmanship standards and their application on ESA projects
Barrie D. DunnThis paper aims to describe some of the European Space Agency (ESA) workmanship standards which are based on industrial practices. Coordination with National Aeronautics and Space…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang