Table of contents
Effect of multiple reflow cycles on ball impact responses of Sn‐Ag‐Cu solder joints
Yi‐Shao Lai, C.R. Kao, Hsiao‐Chuan Chang, Chin‐Li KaoThe purpose of this paper is to report the effect of multiple reflow cycles on ball impact test (BIT) responses and fractographies obtained at an impact velocity of 500 mm/s on…
Edge tail length effect on reliability of DBC substrates under thermal cycling
Guangcheng Dong, Guangyin (Thomas) Lei, Xu Chen, Khai Ngo, Guo‐Quan LuDirect‐bond‐copper (DBC) substrates crack after about 15 thermal cycles from −55 to 250°C. The purpose of this paper is to study the phenomenology of thermal‐cracking to determine…
Effect of substrate material and thickness on reliability of ACA bonded flip chip joints
Laura Frisk, Anne CuminiThe purpose of this paper is to investigate the effect of substrate material and thickness on the thermal cycling reliability of flip chip joints assembled with anisotropic…
Composite coating structure in an implantable electronic device
Kati Kokko, Hanna Harjunpää, Pekka Heino, Minna KellomäkiThe purpose of this paper is to investigate the influence of composite coating structure on the reliability of adhesive flip chip joints. The need for conformal coating is…
Reliability analysis of a novel fan‐out type WLP
Ming‐Chih Yew, Mars Tsai, Dyi‐Chung Hu, Wen‐Kun Yang, Kuo‐Ning ChiangThe wafer level package (WLP) is a cost‐effective solution for electronic packaging and has been increasingly applied in recent years. The purpose of this paper is to propose a…
Six sigma analysis of SMD feeding parameters and board assembly quality
Pekka Kytösaho, Timo LiukkonenLittle interest has been shown in pickup conditions and parameters and their effect on placement accuracy in the literature before. The purpose of this paper is to find out the…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang