Soldering & Surface Mount Technology: Volume 22 Issue 1

Activities during melting and reflowing behaviour of solders

The purpose of this paper is to visualise the activities of three solders; Sn‐37Pb, Sn‐9Zn and Sn‐3.5Ag on Cu substrates during reflow near their melting points and to relate them…

Effect of stand‐off height on the microstructure and mechanical behaviour of solder joints

The purpose of this paper is to investigate the effect of stand‐off height (SOH) on the microstructure and mechanical behaviour of the solder joints in high density…

Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux

The purpose of this paper is to develop a new alloying method for solders by using a metal organic modified flux in solder pastes.

X‐ray solder alloy volume measurement (XSVM) in pin‐in‐paste technology (PIP)

The purpose of this paper is to develop a novel automatic and accurate measurement technique for the volume of solder which is present in solder paste in pin‐in‐paste (PIP…

Moisture effects on adhesion of non‐conductive adhesive attachments

Personal and portable electronic devices are becoming an important part of the everyday lives. Electronics miniaturization has been and continues to be the most important driver…

An experimental methodology for the study of co‐planarity variation effects in anisotropic conductive adhesive assemblies

Non‐planarity of assemblies and co‐planarity variation effects on anisotropic conductive adhesive (ACA) assemblies have been a concern for ACA users since the materials are first…

Tin pest in lead‐containing solders

The purpose of this paper is to describe the effects of mechanical testing and thermal treatment prior to storage at either −18 or −40°C, for periods in excess of ten years on the…

SIPLACE announces new strategy and more innovations

Vantage solder saver from Contax

Alpha – Cookson Electronics business in Benelux subject of MBO

Measuring the impact of research

NBS adds more new SMT assembly capacity

Printed Circuits Handbook

Marantz launches value-driven automated inspection island

OK International’s new MRS-1000 Modular Rework System set to boost productivity

SMT/HYBRID/PACKAGING 2009

Seica SpA launches brand new bare board flying probe system

International Electronics Forum Geneva, Switzerland, 1 and 2 October 2009, The semiconductor industry contributes to global economic growth

Quantum CAD hire key people to increase work in the UK market

New low temperature materials from intertronics

International diary

Hitachi achieves 40 per cent reduction in PCB place-and-route design time with cadence global route environment

OK International launches new product catalogue

Editorial

Kirsten announces major distributor changes

HumiSeal contributes to world’s first interactive conformal coating CD-ROM

Stencil ordering and modification made easier

Innovative Electronics Manufacturing Research Centre, 4th Annual Conference, Loughborough, UK 2 September 2009

New DSO-family – small, fast and low cost

SMART Group 25th Anniversary Conference22 October 2009