Soldering & Surface Mount Technology: Volume 23 Issue 1

Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints

Liang Zhang, Song‐bai Xue, Li‐li Gao, Zhong Sheng, Wei Dai, Feng Ji, Huan Ye, Yan Chen, Sheng‐lin Yu

The purpose of this paper is to explore the formation and growth mechanism of bulk Cu₆Sn₅ intermetallic compounds, selecting Sn‐Ag‐Cu‐Ce solders as specimens.

Addition of cobalt nanoparticles into Sn‐3.8Ag‐0.7Cu lead‐free solder by paste mixing

S.L. Tay, A.S.M.A. Haseeb, Mohd Rafie Johan

The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn‐3.8Ag‐0.7Cu solder.

Development of a lead‐free solder: Sn‐4.0Bi‐3.7Ag‐0.9Zn

Xun Wang, Yongchang Liu, Liming Yu, Zhizhong Dong, Zhiming Gao

The purpose of this paper is to study the relationship between microstructure and mechanical properties of Sn‐4.0Bi‐3.7Ag‐0.9Zn (in wt%) solder, and the structural evolution of…

Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders

Z. Moser, P. Fima, K. Bukat, J. Sitek, J. Pstruś, W. Gąsior, M. Kościelski, T. Gancarz

The purpose of this paper is to investigate the influence of In additions on the wetting properties of the Sn2.86Ag0.40Cu (in wt%) eutectic‐based alloys, on a copper substrate, in…

Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies

O. Nousiainen, T. Kangasvieri, R. Rautioaho, J. Vähäkangas

The purpose of this paper is to investigate the thermal fatigue endurance of two lead‐free solders used in composite solder joints consisting of plastic core solder balls (PCSB…

A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints

Bo Wang, Fengshun Wu, Yiping Wu, Bing An, Hui Liu, Jian Zou

The purpose of this paper is to identify the solder joint with optimal mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints.

Printed Electronics – Technologies and Applications, Electronics Yorkshire, 23 September 2010

New DEK & Partnertec facility helps customers in Benelux “Expect More”

eFutures Academic Community Meeting, Glaziers Hall, London, 8 October 2010

MYDATA turnover breaks all records

A new company descriptor takes us into a new era

Rebecca Marsh

New IPC training video updates best practices for hand soldering terminals

Gaining flexibility in SMT production

Italian weaving machine specialist ROJ upgrades its production with SIPLACE SX placement machines

SisTech Manufacturing Inc. has installed a Europlacer iineo-II SMT platform at its facility in Bend, Oregon

New software prevents unnecessary trips to and from inventory

MYDATA boosts performance remotely

The 5th Annual IeMRC Conference, Holywell Park Conference Centre, Loughborough University, 21 September 2010

SMART GROUP 26th Annual Conference, The Oxfordshire Golf Club, Thame, Oxfordshire, October 6 and 7 2010

Alpha® Stencils in the movies

International diary

Prism staff pass lean manufacturing NVQs

Axis Electronics upgrades with MYDATA

Essemtec books record sales in August

MEC expands production capacity

SIPLACE Line Monitor provides relevant production data at a glance

DEK ProActiv rewrites printing rules to revolutionise paste transfer efficiency

Manufacturing Technology Centre – Electronics Manufacturing Launch, Ansty Park, Coventry, 19 August 2010