Table of contents
Understanding the effects of addition of copper nanoparticles to Sn‐3.5 Ag solder
Aemi Nadia, A.S.M.A. HaseebThe purpose of this paper is to focus on the fabrication of SAC nanocomposites solder and discuss the effects of nanoCu addition on the structure and properties of resulted…
Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead‐free solder pastes
A.E. Marks, N.N. Ekere, S. Mallik, R. BhattiThe purpose of this paper is to investigate how the formulation of a solder paste (with regards to the flux and particle size distribution (PSD)), can influence its creep and…
Comparison of ROSE, C3/IC, and SIR as an effective cleanliness verification test for post soldered PCBA
Kong Hui Lee, Rob Jukna, Jim Altpeter, Kantesh DossThe purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board…
Stability investigations of automatic X‐ray inspection systems
István Latos, Mihály JanóczkiThe purpose of this paper is to develop a new method of evaluating the present state of X‐ray machines used in the electronics device manufacturing industry.
Enhanced thermal fatigue endurance and lifetime prediction of lead‐free LGA joints in LTCC modules
O. Nousiainen, O. Salmela, J. Putaala, T. KangasvieriThe purpose of this paper is to describe the effect of indium alloying on the thermal fatigue endurance of Sn3.8Ag0.7Cu solder in low‐temperature co‐fired ceramic (LTCC) modules…
Effect of solder joint integrity on the thermal performance of a TEC for a 980 nm pump laser module
G. Takyi, E.H. Amalu, P.K. BernaskoThe purpose of this paper is to evaluate the effect of solder wettability on the thermal performance of a thermo‐electric cooler (TEC) of a 980 nm pump laser module.
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang