Table of contents
Interfacial reaction and dissolution behavior of Cu substrate in molten Sn‐3.8Ag‐0.7Cu in the presence of Mo nanoparticles
M.M. Arafat, A.S.M.A. Haseeb, Mohd Rafie JohanIn electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid‐liquid interface…
Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper
K. Bukat, M. Kościelski, J. Sitek, M. Jakubowska, A. MłożniakThe purpose of this paper is to investigate the influence of silver nanoparticle additions on the wetting properties of Sn‐Ag‐Cu (SAC) solder paste. In this investigation, the…
Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests
Jue Li, Hongbo Xu, Jussi Hokka, Toni T. Mattila, Hongtao Chen, Mervi Paulasto‐KröckelThe purpose of this paper is to study the reliability of SnAgCu solder interconnections under different thermal shock (TS) loading conditions.
Modifications of the 85/85 test and the temperature cycling test for tantalum capacitors
Johanna Virkki, Lauri Sydänheimo, Pasi RaumonenAccelerated tests are commonly used to evaluate the reliability of electronic components and to detect failures caused by environmental conditions in field use. Many standard…
Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering
Peng Xue, Song‐bai Xue, Liang Zhang, Yi‐fu Shen, Li‐li Gao, Sheng‐lin Yu, Hong Zhu, Zongjie Han, Yan ChenThe purpose of this paper is to investigate the laser soldering of fine pitch quad flat package (QFP) devices using lead‐free solders and solder joint reliability during thermal…
Occurrence of tin pest on the surface of tin‐rich lead‐free alloys
Agata Skwarek, Marcin Sroda, Mariusz Pluska, Andrzej Czerwinski, Jacek Ratajczak, Krzysztof WitekThe purpose of this paper is to investigate tin pest formation in lead‐free alloys.
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang