Table of contents
The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction
Chien‐Yi Huang, Yueh‐Hsun Lin, Kuo‐Ching Ying, Chen‐Liang KuThe purpose of this paper is to comprehensively explore the effects of critical parameters on solder deposition and to establish a systematic approach for determining guidelines…
Wettability and shear strength of active Sn2Ti solder on Al2O3 ceramics
Roman Koleňák, Michal Chachula, Pavol Šebo, Monika KoleňákováThe purpose of this paper is to investigate the wettability of an active Sn2Ti solder on an Al2O3 ceramic material at temperatures of 700°C and higher. Based on the results of the…
Microstructural evolution of the intermetallic compounds in the high density solder interconnects with reduced stand‐off heights
Bo Wang, Fengshun Wu, Yiping Wu, Liping Mo, Weisheng XiaThis paper aims to investigate the microstructural evolution rules of the intermetallic compound (IMC) layers in high‐density solder interconnects with reduced stand‐off heights…
Process characterization and reliability for the assembly of 01005 chip components
Yong‐Won Lee, Keun‐Soo Kim, Katsuaki SuganumaThe purpose of this paper is to optimize assembly processes in order to minimize defects in the assembly of 01005 chip components.
Systematic mechanical design approach for a flexible printed circuit board assemblies (PCBA) rework cell: part I – generic mechanical design procedure
Necdet Geren, Çağdaş Sarıgül, Melih BayramoğluThe generic design environment for a flexible printed‐circuit board assemblies (PCBA) remanufacturing cell contains four interrelated complex design domains. Mechanical design…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang