Table of contents
Investigation of the wetting of PCBs with SnCu (HASL) and Snimm finishes by SnZnBiIn solders
Krystyna Bukat, Janusz Sitek, Marek Koscielski, Zbigniew Moser, Wladyslaw Gasior, Janusz PstrusThe purpose of this article is to establish why the wetting on PCBs with SnCu (HASL) and Snimm finishes in the presence of a flux is better than the wetting of those on a copper…
A new conformal coating adhesion test for electronic assemblies
Ling Zou, Chris HuntThe purpose of this paper is to present a new test method (tape peel method) to evaluate conformal coating adhesion to electronic assemblies.
A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead‐free solder joints
De‐Shin Liu, Chang‐Lin Hsu, Chia‐Yuan Kuo, Ya‐Ling Huang, Kwang‐Lung Lin, Geng‐Shin ShenThe purpose of this paper is to present a novel high speed impact testing method for evaluating the effects of low temperatures on eutectic and lead‐free solder joints…
Through lifetime monitoring of solder joints using acoustic micro imaging
Ryan S.H. Yang, Derek R. Braden, Guang‐Ming Zhang, David M. HarveyThe purpose of this paper is to evaluate the application of an acoustic micro‐imaging (AMI) inspection technique in monitoring solder joints through lifetime performance and…
A review of stencil printing for microelectronic packaging
Robert Kay, Marc DesmulliezThe purpose of this paper is to present a detailed overview of the current stencil printing process for microelectronic packaging.
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang