Soldering & Surface Mount Technology: Volume 24 Issue 4

Surface finish effect on reliability of SAC 305 soldered chip resistors

The purpose of this paper is to assess the long‐term reliability of lead‐free Sn96.5Ag3.0Cu0.5 (SAC305) under accelerated temperature cycling (ATC) conditions. Test vehicles…

Interfacial IMC layer growth and tensile properties of low‐silver Cu/SACBE/Cu solder joints

In a previous study, the authors proposed a new low‐silver solder alloy Sn‐ x(1.0, 1.5, 2.0)Ag‐0.3Cu‐3.0Bi‐0.05Er (wt.%) (SACBE) and the purpose of this paper is to provide…

Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag‐content Sn‐1Ag‐0.5Cu solder alloy

The purpose of this paper is to investigate the effects of small additions (0.1 and 0.3 wt%) of Fe on the bulk alloy microstructure and tensile properties of low Ag‐content…

SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties

The purpose of this paper is to study the manufacturing of SAC 305 solder paste with multiwall carbon nanotubes (MWCNT) before and after structure modification and also to…

Effect of Pr on properties and Sn whisker growth of Sn‐9Zn‐xPr solder

The purpose of this paper is to improve the properties of Sn−9Zn solder, so as to meet the requirements of industrial applications.

Evaluation of Cu/SnAg microbump bonding processes for 3D integration using wafer‐level underfill film

3D chip stacking is a key technology for 3D integration in which two or more chips are stacked with vertical interconnections. In the case of multi chip stacking with fine pitch…

Editorial

Using Essemtec’s SMD Tower for IGBT storage in a clean room

MIRTEC Europe announces impressive 30 per cent growth in first half of 2012

UVAX Concepts chooses SIPLACE SX

New entry level computed tomography for electronics manufacture quality control

Cogiscan expands team with new application engineer for Europe

Engineered Material Systems debuts UV cure adhesive for disk drive, camera module, optoelectronic and circuit assembly applications

The Institute of Circuit Technology Annual Conference

International diary

iNEMI releases guidelines to reduce risk of creep corrosion

PRIDE Industries reaches new level of cleanliness with its new Trident Trio from Aqueous Technologies

OnCore Manufacturing to attend Juki’s 25,000th shipment celebration and tour in Japan

Tamura develop a new solder paste

Camtek receives repeated orders totalling approxamtely $5m from one of the world’s largest, US based, IDMs

SEHO Systems introduces the cost-effective and energy efficient PowerWave N2

13TH JISSO International Council Meeting – Nurnberg, May 2012

Research to Industry Electronics Conference: Connecting Research to Industry