Soldering & Surface Mount Technology: Volume 25 Issue 2

Characteristics and properties of Bi‐11Ag solder

The purpose of this paper is to study Bi‐11Ag solder for higher application temperatures. The aim of the research work was to determine the soldering, thermal and mechanical…

Electrodeposition of lead‐free solder alloys

The purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)‐free solder alloys, so that new studies can be carried out to solve…

Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn‐3.8Ag‐0.7Cu solder and copper substrate

The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn‐3.8Ag‐0.7Cu (SAC) solder and Cu…

Characterization of vapour phase soldering process zone with pressure measurements

The purpose of this paper is to present a novel approach on the process zone characterization for direct feedback regarding the state of vapour, in order to assure a better…

Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste

The purpose of this paper is to determine: how much the residual curvature could be formed in sintered nano‐silver assembly when it is cooled to room temperature from the…

Applying CHAID algorithm to investigate critical attributes of void formation in QFN assembly

The purpose of this paper is to employ data mining as a new diagnosing scheme for investigating void formation to the thermal pad in quad flat non‐lead (QFN) assembly. Occurrences…

Editorial

Enthone Appoints Dr Stream Chung Global Product Line Manager, WLP & TSV

ACD appoints Jennifer Griffin to Customer Service Manager

SMT developments installed new Inertec selective soldering machine and purchased a new ultravision AOI machine

Nemco opened new 25,000 sq ft facility in Stevenage, UK

Etek Europe installs an SCS Precisioncoat spray and dispense system in its new technology center

IPC-2221B tackles new technologies, techniques

Purdue and Tuskegee universities are leading an international effort to replace conventional electronics with more sustainable technologies

New and improved technical specification for the Nordson DAGE XD7800 Ruby XL X-ray inspection system

Essential updates on RoHS and REACH; an Electronics Yorkshire (EY) Seminar Mid Yorkshire Golf Club, Pontefract, Yorkshire, UK 20 November 2012

VCF Films introduced CEB 500 custom slot-die coating production line

Invotec Group Ltd appoints new sales account manager for South and South West

KIC appoints exclusive distributor for Germany

IPC rolls out new market research subscription services for the electronics industry

Cheap labor becoming a thing of the past around the world

NBS to add Juki’s GL screen printers to all existing manufacturing lines

Balver Zinn acquires global license for SN100C lead-free bar solder

Speedline Technologies, Inc. announces a new partnership with CRM Synergies for the distribution of SMT equipment in Iberia

PP-Elektronix chose Essemtec

International diary

Cambridge Nanotherm introduced Nanotherm MBPCB (metal-backed printed circuit board) that reduces LED device temperature by up to 20°C