Table of contents
Growth behaviors of tin whisker in RE‐doped Sn‐Zn‐Ga solder
Huan Ye, Songbai Xue, Cheng Chen, Yang LiThe purpose of this paper is to investigate the growth behavior and mechanism of Sn whisker induced by RE addition in Sn‐Zn‐Ga‐Pr solder at ambient condition.
Filling analyses of solder paste in the stencil printing process and its application to process design
Won‐Sang Seo, Jong‐Bong KimThe purpose of this paper is to suggest an analysis methodology for the stencil printing process and to obtain proper design parameters that guarantee the successful filling using…
An alternative JEDEC test board design and analysis
Fang Liu, Guang Meng, Junfeng ZhaoThe purpose of this paper is to propose an alternative test board design with only one loading condition and sufficiently large sample size, which is more suitable for the…
The behaviour of solder pastes in stencil printing with electropolishing process
Yong‐Won Lee, Keun‐Soo Kim, Katsuaki SuganumaThe purpose of this paper is to study the effect of the electropolishing time of stencil manufacturing parameters and solder‐mask definition methods of PCB pad design parameters…
Comparison study of SAC405 and SAC405+0.1%Al lead free solders
Roman Koleňák, Robert Augustin, Maroš Martinkovič, Michal ChachulaThe purpose of this paper is to study the effect of the addition of a small amount of Al (0.1 percent) on the properties of lead‐free solder type Sn‐4Ag‐0.5Cu (SAC 405).
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang