Table of contents
SAC solder paste with carbon nanotubes. Part II: carbon nanotubes’ effect on solder joints’ mechanical properties and microstructure
Krystyna Bukat, Janusz Sitek, Marek Koscielski, Wojciech Niedzwiedz, Anna Mlozniak, Malgorzata JakubowskaThe purpose of this work is to investigate the influence of carbon nanotube additions to solder paste on the solder joints mechanical strength and their microstructure. In our…
Cu filling of TSV using various current forms for three‐dimensional packaging application
Myong‐Hoon Roh, Jun‐Hyeong Lee, Wonjoong Kim, Jea Pil JungThe purpose of this paper is to overview the effect of electroplating current wave forms on Cu filling of through‐silicon‐vias (TSV) for three‐dimensional (3D) packaging.
A study into the re‐processing of pure tin termination finishes into tin‐lead
Ian C. Turner, Barrie D. Dunn, Cathy BarnesThe purpose of this paper is to present a process (chemical stripping) that can be used to remove pure tin plating from component leads and propose this activity as a mitigation…
A review: influence of nano particles reinforced on solder alloy
Ervina Efzan Mhd Noor, Amares Singh, Yap Tze ChuanRecently nanoparticles reinforced lead free solders are vastly developed in electronics packaging industry. Studies and investigations have been conducted to learn and investigate…
Ultra‐short vertically aligned carbon nanofibers transfer and application as bonding material
Si ChenThe transferred carbon nanofibers (CNFs) can be applied in flip chip package as interconnect material, as an alternative to the conventional solder and conductive adhesive (CA…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang