Soldering & Surface Mount Technology: Volume 26 Issue 2

Temperature cycling with Peltier elements of boards with SMD components and failure evaluation

Josef Šandera, Michal Nicák

This article aims to discuss the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements. This article describes the…

Reliability analysis of an ACA attached flex-on-board assembly for industrial application

Janne Kiilunen, Laura Frisk

The purpose of this paper is to examine the long-term reliability of an anisotropic conductive adhesive (ACA) attached polyethylene terephthalate (PET) flex-on-board (FOB…

Statistical analysis of stencil technology for wafer-level bumping

Robert W. Kay, Gerard Cummins, Thomas Krebs, Richard Lathrop, Eitan Abraham, Marc Desmulliez

Wafer-level stencil printing of a type-6 Pb-free SAC solder paste was statistically evaluated at 200 and 150 μm pitch using three different stencil manufacturing technologies…

Corrosion of Sn-3.0Ag-0.5Cu thin films on Cu substrates in alkaline solution

Liu Mei Lee, Muhammad Firdaus Mohd Nazeri, Habsah Haliman, Ahmad Azmin Mohamad

– The purpose of this paper is to examine the corrosion behaviors of SAC305 thin film solder alloy in 6 M KOH solution.

Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow

J. Mittal, K.L. Lin

This paper aims to compare the reflow and Zn diffusion behaviors in Sn-Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga (5E) solders during soldering on a Ni/Cu substrate under infrared (IR…