Soldering & Surface Mount Technology: Volume 26 Issue 3

Influence of PTH offset angle in wave soldering with thermal-coupling method

Mohd Sharizal Abdul Aziz, Mohd Zulkifly Abdullah, Chu Yee Khor

– The aim of this study is to investigate the effects of offset angle in wave soldering by using thermal fluid structure interaction modeling with experimental validation.

A method for the tin pest presence testing in SnCu solder alloys

Agata Skwarek, Jan Kulawik, Andrzej Czerwinski, Mariusz Pluska, Krzysztof Witek

The purpose of this study is to develop a testing method for tin pest in tin – copper (SnCu) alloys. Tin pest is the allotropic transformation of white β-tin (body-centered…

Lifetime prediction and design aspects of reliable lead-free non-collapsible BGA joints in LTCC packages for RF/microwave telecommunication applications

Jussi Putaala, Olli Salmela, Olli Nousiainen, Tero Kangasvieri, Jouko Vähäkangas, Antti Uusimäki, Jyrki Lappalainen

The purpose of this paper is to describe the behavior of different lead-free solders (95.5Sn3.8Ag0.7Cu, i.e. SAC387 and Sn7In4.1Ag0.5Cu, i.e. SAC-In) in thermomechanically loaded…

Solder joint imagery compressing and recovery based on compressive sensing

Huihuang Zhao, Yaonan Wang, Zhijun Qiao, Bin Fu

The purpose of this paper is to develop an improved compressive sensing algorithm for solder joint imagery compressing and recovery. The improved algorithm can improve the…

Tin oxide coverage on tin whisker surfaces, measurements and implications for electronic circuits

Barrie D. Dunn, Grazyna Mozdzen

This paper aims to evaluate the morphology and thickness of oxides that form on the surfaces of tin whiskers. The problems related to the growth of tin whiskers are stated, and…

Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys

Ervina Efzan Mhd Noor, Amares Singh

The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative…

Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurement

Weisheng Xia, Ming Xiao, Yihao Chen, Fengshun Wu, Zhe Liu, Hongzhi Fu

– The purpose of this paper is to study the thermal warpage of a plastic ball grid array (PBGA) mounted on a printed circuit board (PCB) during the reflow process.

Erratum