Soldering & Surface Mount Technology: Volume 26 Issue 4

Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing

Guokui Ju, Fei Lin, Wenzhen Bi, Yongjiu Han, Wang Junjie, Xicheng Wei

The purpose of this study was to comparatively investigate interfacial intermetallic compounds (IMCs) in the Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu (SACBC/Cu) and Sn3.0Ag0.5Cu/Cu (SAC/Cu…

Failure analysis on electrolytic Ni/Au surface finish of PCB used for wire bonding and soldering

Fei-Jun Chen, Shi Yan, Zhen-Guo Yang

The purpose of this study is to address two kinds of printed circuit board (PCB) failures with electrolytic Ni/Au as the surface finish. One was the weak bondability of gold wires…

Contamination profile on typical printed circuit board assemblies vs soldering process

Helene Conseil, Morten Stendahl Jellesen, Rajan Ambat

The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of…

Effects of aging on microstructure evolution and mechanical properties of high-temperature Zn-4Al-3Mg solder

Huan Wang, Yongchang Liu, Huixia Gao, Zhiming Gao

This paper aims to investigate the transformations during aging at 200°C for different periods on microstructure and mechanical properties of high-temperature Zn-4Al-3Mg solders…

Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering

Olivér Krammer

The purpose of this paper is to compare the reliability and intermetallic layer (IML) of solder joints prepared with infrared (IR) and vapour phase (VP) soldering. The reliability…

Comparing 2D and 3D numerical simulation results of gas flow velocity in convection reflow oven

Balázs Illés

This paper aims to compare and study two-dimensional (2D) and three-dimensional (3D) computational fluid dynamics simulation results of gas flow velocity in a convection reflow…