Soldering & Surface Mount Technology: Volume 27 Issue 4

Investigation of oxygen followed by argon plasma treatment on LED chip bond pad for wire bond application

Hui Yuen Peng, Mutharasu Devarajan, Teik Toon Lee, David Lacey

The purpose of this paper is to investigate the efficiencies of argon (Ar), oxygen (O₂) and O₂ followed by Ar (O₂→Ar) plasma treatments in terms of contaminant removal and wire…

Realistic warpage evaluation of printed board assembly during reflow process

Soonwan Chung, Jae B. Kwak

This paper aims to develop an estimation tool for warpage behavior of slim printed circuit board (PCB) array while soldering with electronic components by using finite element…

Relative effect of solder flux chemistry on the humidity related failures in electronics

Vadimas Verdingovas, Morten Stendahl Jellesen, Rajan Ambat

This paper aims to investigate the effect of no-clean flux chemistry with various weak organic acids (WOAs) as activators on the corrosion reliability of electronics with emphasis…

Bonding of zero-shrink LTCC with alumina ceramics

Jakub Somer, Michal Štekovič, František Urban, Josef Šandera, Ivan Szendiuch

The purpose of this paper is to focus on a description of reliable bonding technique of zero-shrink low-temperature co-fired ceramic (LTCC) and alumina ceramics. LTCC is widely…

Recent advances in mechanical properties of anisotropic conductive adhesive film for microelectronic packaging

Lilan Gao, Hong Gao, Xu Chen

This review paper aims to provide a better understanding of formulation and processing of anisotropic conductive adhesive film (ACF) material and to summarize the significant…

The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies

Ye Tian, Justin Chow, Xi Liu, Suresh K. Sitaraman

The purpose of this paper is to study the intermetallic compound (IMC) thickness, composition and morphology in 100-μm pitch and 200-μm pitch Sn–Ag–Cu (SAC305) flip-chip…

Thermal cycling aging effects on the ratcheting behavior of anisotropic conductive film

Hong Gao, Jianhua Ma, Lilan Gao, Dunji Yu, Jinsheng Sun

The purpose of this paper is to determine: how the thermal cycling aging affects the ratcheting behavior of anisotropic conductive adhesive film (ACF); how the loading conditions…