Soldering & Surface Mount Technology: Volume 29 Issue 1

Guest editorial

Agata Skwarek

New method for determining correction factors for pin-in-paste solder volumes

Oliver Krammer, Bertalan Varga, Karel Dušek

This paper aims to present a new method to calculate the appropriate volume of solder paste necessary for the pin-in-paste (PIP) technology. By the aid of this volume calculation…

Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing

Oliver Krammer, Benjámin Gyarmati, András Szilágyi, Richárd Storcz, László Jakab, Balázs Illés, Attila Géczy, Karel Dušek

A measurement method has been developed to reveal the viscosity change of solder pastes during stencil printing. This paper aimed to investigate thixotropic behaviour, the…

Optimization of solder paste quantity considering the properties of solder joints

Martin Hirman, Frantisek Steiner

The purpose of this paper is to find an optimum between the quantity of solder paste and the desired properties of the soldered joint. A reduction of solder paste quantity is…

The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials

Janusz Sitek, Marek Koscielski, Janusz Borecki, Tomasz Serzysko

The purpose of this paper is to evaluate the influence of solder powders sizes applied in soldering materials used for Package-on-Package (PoP) system manufacture as well as other…

X-ray inspection and Six-Sigma in analysis of LED thermal pad coverage

Barbara Dziurdzia, Janusz Mikolajek

The purpose of this paper is to evaluate selected methods of reduction voidings in lead-free solder joints underneath thermal pads of light-emitting diodes (LEDs), using X-ray…

Studying heat transfer on inclined printed circuit boards during vapour phase soldering

Attila Geczy, Daniel Nagy, Balazs Illes, Laszlo Fazekas, Oliver Krammer, David Busek

The paper aims to present an investigation of heating during vapour phase soldering (VPS) on inclined printed circuit board (PCB) substrates. The PCB is a horizontal rectangular…

Real-time profiling of reflow process in VPS chamber

Lubomir Livovsky, Alena Pietrikova

This paper aims to present a new method of real-time monitoring of thermal profiles applied in vapour phase soldering (VPS) reflow processes. The thermal profile setting is a…

Structure and thermal behavior of lead-free solders prepared by rapid solidification of their melt

Martin Durisin, Alena Pietrikova, Juraj Durisin, Karel Saksl

The paper aims to investigate the structure and thermal stability of newly developed lead-free Sn-based alloys which can be used as novel materials in the soldering of electronic…

Stability of electrical properties for mechanically exposed thick- and thin-film resistors on flexible substrates

Andrzej Dziedzic, Pawel Osypiuk, Wojciech Steplewski

The paper aims to verify the influence of mechanical factors (longitudinal elongation at constant stretching velocity, constant elongation strain and cyclic compressive and…

Corrosion-induced tin whisker growth in electronic devices: a review

Balázs Illés, Barbara Horváth, Attila Géczy, Olivér Krammer, Karel Dušek

The aim of this paper is to present a review of the tin whisker growth phenomena. The study focuses mainly on whisker growth in a corrosive climate when the main inducing factor…