Soldering & Surface Mount Technology: Volume 3 Issue 2

Quantitative Solderability Measurement of Electronic Components: Part 6: An Inter‐laboratory Comparison of Wetting Balance Measurements

C. Lea

The three European Community manufacturers of commercially available wetting balances for measuring the solderability of electronic components have participated in an…

Solderless Alternatives to Surface Mount Component Attachment

R.A. Bourdelaise

Solder has been the primary method of component attachment since the early days of radio. This tradition carries with it an overhead which becomes increasingly expensive as the…

Water Soluble Fluxes, their Reliability and their Usefulness as a Means of Eliminating CFC‐113 Usage

B.N. Ellis

This paper outlines the composition of water soluble fluxes for the electronics industry and their methods of use when wave soldering and reflowing tinned coatings and solder…

Characterising the Corrosion Properties of Flux Residues: Part 1: Test Method Development and Failure Mode Identification

L.J. Turbini, G.B. Freeman, M.H. Smith, J.D. Finney, R.D. Boswell, J.F. Lane

A new corrosion test for assessing flux residues is applied to marginally cleaned water soluble fluxed test boards and low solids/no clean fluxed test boards. This test method…

Experimental Investigation and Numerical Simulation of the SMT Laser Microsoldering Thermal Process

C.Q. Wang, Y.Y. Qian, Y.H. Jiang

In this paper, a numerical simulation of the thermal process in SMT laser microsofdered joints has been developed, in which the influences on the thermal process of factors such…

The Impact of Crevices beneath Surface Mounted Devices on the Cleaning Efficiency

P.‐E. Tegehall

The transition to surface mounted device (SMD) technology in electronics manufacturing has placed new demands on the post‐solder cleaning process. For spacecraft electronic…

Flux Mechanisms from Solderability Measurements

C.A. MacKay

Reaction rate curves for a complete range of rosin based fluxes, calculated from observed solderability wetting time curves on progressively more heavily oxidised copper, are…

SMART group news

Tony Wood

This design‐based seminar was aimed at broadening the horizons of designers and engineers. The greatest area of cost reduction in any electronics project is in making the right…

International association news

R.A. Shackleford

The programme will cover various aspects of high technology joining processes ranging from soldering and brazing to diffusion and adhesive bonding. The papers presented will cover…

Industry news

Due to recent expansion A.R.T., specialising in rework technology, has appointed Graham Devenish as Technical Director. Mr Devenish has been involved with the company for many…

New Products

Stork Graphics has recently introduced the HiMesh Mask specially suited to surface mount technology applications. This screen printing mask, made of 100% nickel, differs from…