Soldering & Surface Mount Technology: Volume 3 Issue 3

What of 1992?

NORMAN HODSON

What are the prospects for the electronics industry in Europe? What part do trade organisations have to play in the development of the electronics industry both today and in the…

Outer Lead Bonding (Flat‐pack Soldering)—A Precision Soldering Process Demanding High Standards

K. Lindner, T. Reinders

Outer lead bonding and flat pack soldering are techniques which are becoming more and more important. Due to the fact that pitches decrease and chip sizes increase, the soldering…

Reliability Prediction Tools for SMD Solder Joints

D.C. Whalley

There is continued concern over the ability of SMD solder joints to survive in the harsh operating environments endured, for example, by automotive and aerospace products. This…

The Use of Capillary Action Measurements for Solderability Improvement

M. Wolverton, B. Abies

This paper describes the tests performed to evaluate the solder capillary action which occurs within a gap between two solderable surfaces during soldering. The goal was to…

The Influence of Solder Powder on the Properties and Storage Performance of an RMA Solder Paste

M. Warwick, H. Steen

Solder pastes are complex products which are designed to meet the conflicting requirements of printability, slump resistance, good tack and a range of reflow conditions. This…

Evidence that Visual Inspection Criteria for Soldered Joints are no Indication of Reliability

C. Lea

Exemplary data are given that demonstrate unequivocally the inapplicability of commonly used visual inspection criteria for judging the long‐term service reliability of soldered…

Microstructural and Mechanical Characterisation of 43/43/14 Tin/Lead/Bismuth

J.L. Marshall, J. Calderon, J. Sees

A mechanical and microstructural study was performed of 43/43/14 tin/lead/bismuth solder. This alloy melts lower than the commonly used tin/lead solders and therefore holds…

After CFCs: Option: Semi‐aqueous Non‐volatile Solvents

C. Lea

The demise of the CFC‐113/alcohol azeotropic solvent for de‐fluxing circuit assemblies after soldering has led, in recent years, to the electronics assembly industry being offered…

SMART group news

Bob Willis, Glyn Jackson, Colin Lea, C.O Mathuna, Padraig Healy

Electronics exhibitions are the same the world over, very tiring affairs. If your stand is busy, time flies; if not, the strain is more noticeable.

International association news

M.A. Whitmore

This, the first BABS meeting to be held at the Institute of Metals was well supported with over 60 delegates in attendance. The seminar Chairman, Dr Hector Steen of Multicore…

Industry news

Dr Wallace Rubin has retired from his post as Technical Director of Multicore Solders Ltd after a distinguished career spanning 37 years with the company. He will continue to act…

New Products

Universal Instruments' recently introduced 4785 HSP High Speed Placement system is capable of handling sizes ranging from 20 in. × 18 in. to 4 in. × 4 in. and assembling a wide…