Soldering & Surface Mount Technology: Volume 30 Issue 2

Guest editorial

Agata Skwarek

Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

Balázs Illés, Agata Skwarek, Attila Géczy, László Jakab, David Bušek, Karel Dušek

The vacuum vapour phase soldering method was investigated by numerical simulations. The purpose of this study was to examine the temperature changes of the solder joints during…

Effects of high current density on lead-free solder joints of chip-size passive SMD components

Attila Geczy, Daniel Straubinger, Andras Kovacs, Oliver Krammer, Pavel Mach, Gábor Harsányi

The purpose of this paper is to present a novel approach on investigating critical current densities in the solder joints of chip-size surface mounted device (SMD) components. The…

The influence of a soldering manner on thermal properties of LED modules

Krzysztof Górecki, Barbara Dziurdzia, Przemyslaw Ptak

This paper aims to present the results of the influence of a manner of soldering light emitting diodes (LEDs) to the metal core printed circuit board on thermal parameters of the…

Convection vs vapour phase reflow in LED and BGA assembly

Barbara Dziurdzia, Maciej Sobolewski, Janusz Mikolajek

The aim of this paper is to evaluate using statistical methods how two soldering techniques – the convection reflow and vapour phase reflow with vacuum – influence reduction of…

In–Bi low-temperature SLID bonding for piezoelectric materials

Knut E. Aasmundtveit, Trym Eggen, Tung Manh, Hoang-Vu Nguyen

This paper aims to demonstrate low-temperature bonding for piezoelectric materials at temperatures well below the relevant Curie temperatures so as to avoid depolarization of the…

Characterisation of Cu/Cu bonding using self-assembled monolayer

Maria Lykova, Iuliana Panchenko, Ulrich Künzelmann, Johanna Reif, Marion Geidel, M. Jürgen Wolf, Klaus-Dieter Lang

Cu/Cu diffusion bonding is characterised by high electrical and thermal conductivity, as well as the mechanical strength of the interconnects. But despite a number of advantages…

Investigating the attack angle of squeegees with different geometries

Oliver Krammer, László Jakab, Balazs Illes, David Bušek, Ivana Beshajová Pelikánová

The attack angle of stencil printing squeegees with different geometries was analysed using finite element modelling.

Residual free solder process for fluxless solder pastes

Alexander Hanss, Gordon Elger

For soldering, flux is essential because it enables the wetting of the molten solder. Fluxless soldering, i.e. residue-free soldering with the aid of gaseous activators, has been…

Fine line screen printed silver electrodes for copper electrodeposition

Kazimierz Drabczyk

In this paper, results of the studies on the copper deposition on screen-printed fine-line front electrode of the solar cell were presented. The silver consumption is an important…