Soldering & Surface Mount Technology: Volume 30 Issue 3

Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study

Jagjiwan Mittal, Kwang-Lung Lin

This paper aims to study the diffusion of Zn, Ni and Sn in the liquid state during the reflow ageing of the Sn-Zn solder above its melting point on an Ni/Cu substrate in relation…

Growth kinetics of IMC at the solid Cu/liquid Sn interface

Zuozhu Yin, Fenglian Sun, Yang Liu, Yang Liu

The purpose of this paper is to investigate growth kinetics of interfacial Cu-Sn intermetallic compound (IMC) at the solid Cu/liquid Sn interface.

Effects of Mn nanoparticle addition on wettability, microstructure and microhardness of low-Ag Sn-0.3Ag-0.7Cu-xMn(np) composite solders

Yu Tang, Shaoming Luo, Guoyuan Li, Zhou Yang, Chaojun Hou

The purpose of this paper is to investigate of the effects of Mn nanoparticle addition on the wettability, microstructure and microhardness of SAC0307-xMn(np) (SAC: Sn–Ag–Cu; x …

Optimising pin-in-paste technology using gradient boosted decision trees

Péter Martinek, Oliver Krammer

This paper aims to present a robust prediction method for estimating the quality of electronic products assembled with pin-in-paste soldering technology. A specific board quality…

Reliability assessment of electronic assemblies under vibration by statistical factorial analysis approach

Mohammad Gharaibeh

This paper aims to present a reliability performance assessment of electronic packages subjected to harmonic vibration loadings by using a statistical factorial analysis…

Effects of solder paste on thermal and optical performance of high-power ThinGaN white LED

Muna E. Raypah, Mutharasu Devarajan, Fauziah Sulaiman

Thermal management of high-power (HP) light-emitting diodes (LEDs) is an essential issue. Junction temperature (T_J) and thermal resistance (R_th) are critical parameters in…

Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire

Izhan Abdullah, Muhammad Nubli Zulkifli, Azman Jalar, R. Ismail

The relationship between the bulk and localized mechanical properties is critically needed, especially to understand the mechanical performance of solder alloy because of smaller…