Soldering & Surface Mount Technology: Volume 31 Issue 2

Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys

Mohammad Gharaibeh, Aaron J. Stewart, Quang T. Su, James M. Pitarresi

This paper aims to investigate and compare the reliability performance of land grid array (LGA) and ball grid array (BGA) solders, as well as the SAC105 and 63Sn37Pb solder…

Influence of thermal shock cycles on Sn-37Pb solder bumps

Guisheng Gan, Da-quan Xia, Xin Liu, Cong Liu, Hanlin Cheng, Zhongzhen Ming, Haoyang Gao, Dong-hua Yang, Yi-ping Wu

With continuous concerning on the toxic of element Pb, Pb-free solder was gradually used to replace traditional Sn-Pb solder. However, during the transition period from Sn-Pb to…

Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

Roman Koleňák, Igor Kostolný, Jaromír Drápala, Martin Kusý, Matej Pašák

This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first…

Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition

Wan Yusmawati Wan Yusoff, Norliza Ismail, Nur Shafiqa Safee, Ariffin Ismail, Azman Jalar, Maria Abu Bakar

The purpose of this paper is to discuss the effect of a blast wave on the microstructure, intermetallic layers and hardness properties of Sn0.3Ag0.7Cu (SAC0307) lead-free solder.

Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly

Fakhrozi Che Ani, Azman Jalar, Abdullah Aziz Saad, Chu Yee Khor, Mohamad Aizat Abas, Zuraihana Bachok, Norinsan Kamil Othman

This study aims to investigate the NiO nano-reinforced solder joint characteristics of ultra-fine electronic package.

Rheology of F620 solder paste and flux

Flavia V. Barbosa, José C.F. Teixeira, Senhorinha F.C.F. Teixeira, Rui A.M.M. Lima, Delfim F. Soares, Diana M.D. Pinho

The aim of this paper is to characterize the rheological properties of the flux media exposed to different levels of solicitation and to determine its influence on the rheology of…

Design of a bi-manual haptic interface for skill acquisition in surface mount device soldering

Jose James, Bhavani Rao R., Gabriel Neamtu

Offering unskilled people training in engineering and vocational skills helps to decrease unemployment rate. The purpose of this paper is to augment actual hands-on conventional…