Soldering & Surface Mount Technology: Volume 33 Issue 4

Optimized cerium addition for microstructure and mechanical properties of SAC305

Riaz Muhammad, Umair Ali

This paper aims to analyze the effect of cerium addition on the microstructure and the mechanical properties of Tin-Silver-Copper (SAC) alloy. The mechanical properties and…

Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints

Xu Han, Xiaoyan Li, Peng Yao, Dalong Chen

This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times.

Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana

Frank Kwabena Afriyie Nyarko, G. Takyi

A numerical study on the reliability of soldered interconnects of c-Si solar photovoltaic cells has been conducted.

Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature

Gui-sheng Gan, Liujie Jiang, Shiqi Chen, Yongqiang Deng, Donghua Yang, Zhaoqi Jiang, Huadong Cao, Mizhe Tian, Qianzhu Xu, Xin Liu

Low-Ag SAC solder will lead to a series of problems, such as increased the melting range and declined the solderability and so on. These research studies do not have too…

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Waluyo Adi Siswanto, Kirill Borodin, Zaid Hamid Mahmoud, A. Surendar, Sami Sajjadifar, Galiya Abdilova, Jun Chang

The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the…

Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic solders

Chung-Yung Lin

This paper aims to derive a model of growth kinetics of the intermetallic compound (IMC) layer formed in the reaction between liquid Sn-based solders and Ni particle…