Soldering & Surface Mount Technology: Volume 33 Issue 5

Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics

Mathias Ekpu

In microelectronics industry, the reliability of its components is a major area of concern for engineers. Therefore, it is imperative that such concerns are addressed by using the…

Impact of thermal interface material on luminous flux curve of InGaAlP low-power light-emitting diodes

Muna E. Raypah, Mutharasu Devarajan, Shahrom Mahmud

One major problem in the lighting industry is the thermal management of the devices. Handling of thermal resistance from solder point to the ambiance of the light-emitting diode…

Simulation of jet printing of solder paste for surface mounted technology

Gustaf Eric Mårtensson, Johan Göhl, Andreas Mark

The purpose of this study is to propose a novel simulation framework and show that it captures the main effects of the deposition process, such as droplet shape, volume and speed.

Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding

F Sun, Zhen Pan, Yang Liu, Xiang Li, Haoyu Liu, Wenpeng Li

The purpose of this paper is to quickly manufacture full Cu₃Sn-microporous copper composite joints for high-temperature power electronics applications and study the microstructure…

Surface energetic-based analytical filling time model for flip-chip underfill process

Fei Chong Ng, Mohamad Aizat Abas

This paper aims to present new analytical model for the filling times prediction in flip-chip underfill encapsulation process that is based on the surface energetic for post-bump…

Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques

Ali Sezer, Aytaç Altan

In the production processes of electronic devices, production activities are interrupted due to the problems caused by soldering defects during the assembly of surface-mounted…