Soldering & Surface Mount Technology: Volume 34 Issue 2

Defect patterns study of pick-and-place machine using automated optical inspection data

Yuqiao Cen, Jingxi He, Daehan Won

This paper aims to study the component pick-and-place (P&P) defect patterns for different root causes based on automated optical inspection data and develop a root cause…

Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process

Xu Han, Xiaoyan Li, Peng Yao

This study aims to investigate the effect of ultrasound on interfacial microstructures and growth kinetics of intermetallic compounds (IMCs) at different temperatures.

Effect of different soldering temperatures on the properties of COB light source

Zhao Wang, Yuefeng Li, Jun Zou, Bobo Yang, Mingming Shi

The purpose of this paper is to investigate the effect of different soldering temperatures on the performance of chip-on-board (COB) light sources during vacuum reflow soldering.

Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

Xiuqi Wang, Fenglian Sun, Bangyao Han, Yilun Cao, Jinyang Du, Long Shao, Guohuai Liu

The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying…

Influence of moisture concentration and hydrophobic material on induced stress in FCBGA package under reflow

Elwin Heng, Mohd Zulkifly Abdullah

This paper focuses on the fluid-structure interaction (FSI) analysis of moisture induced stress for the flip chip ball grid array (FCBGA) package with hydrophobic and hydrophilic…

Effect of external static magnetic field on the particle distribution, the metallurgical process and the microhardness of Sn3.5Ag solder with magnetic Ni particles

Jianhua Wang, Hongbo Xu, Li Zhou, Ximing Liu, Hongyun Zhao

This paper aims to investigate the mechanism of Ni particles distribution in the liquid Sn3.5Ag melt under the external static magnetic field. The control steps of Ni particles…

Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints

Jianing Wang, Jieshi Chen, Zhiyuan Zhang, Peilei Zhang, Zhishui Yu, Shuye Zhang

The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as…