Soldering & Surface Mount Technology: Volume 34 Issue 3

Cu3Sn-microporous copper composite joint for high-temperature die-attach applications

Zhen Pan, Fenglian Sun

The purpose of this paper is to design a novel die-attach composite joint for high-temperature die-attach applications based on transient liquid phase bonding. Moreover, the…

Design criteria for pad and stencil with high pick-and-Place yield

Chien-Yi Huang, Christopher Greene, Chao-Chieh Chan, Ping-Sen Wang

This study aims to focus on the passive components of System in Package SiP modules and discusses the geometric pad designs for 01005-sized passive components, the front end…

Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints

Yang Liu, Yuxiong Xue, Min Zhou, Rongxing Cao, Xianghua Zeng, Hongxia Li, Shu Zheng, Shuang Zhang

The purpose of this paper is to investigate the effects of Sn-Ag-x leveling layers on the mechanical properties of SnBi solder joints. Four Sn-Ag-x (Sn-3.0Ag-0.5Cu…

A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints

Yanruoyue Li, Guicui Fu, Bo Wan, Zhaoxi Wu, Xiaojun Yan, Weifang Zhang

The purpose of this study is to investigate the effect of electrical and thermal stresses on the void formation of the Sn3.0Ag0.5Cu (SAC305) lead-free ball grid array (BGA) solder…

Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder

Xinmeng Zhai, Yue Chen, Yuefeng Li

The purpose of this paper is to develop a new composite solder to improve the reliability of composite solder joints. Nano-particles modified multi-walled carbon nanotubes…

Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing

Guang Chen, Yao-Feng Wu

The purpose of this paper is to investigate the effect of titanium nitride (TiN) on microstructure and composition of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under a large…