Soldering & Surface Mount Technology: Volume 34 Issue 5

Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging

Xinmeng Zhai, Yue Chen, Yuefeng Li, Jun Zou, Mingming Shi, Bobo Yang

This study aims to study the mechanical, photoelectric, and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip light-emitting diode (LED) package…

An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model

Yangyang Lai, Ke Pan, Yuqiao Cen, Junbo Yang, Chongyang Cai, Pengcheng Yin, Seungbae Park

This paper aims to provide the proper preset temperatures of the convection reflow oven when reflowing a printed circuit board (PCB) assembly with varied sizes of components…

Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging

Rizk Mostafa Shalaby

This study aims to summarize the effects of minor addition of Ho REE on the structure, mechanical strength and thermal stability of binary Sn- Ag solder alloys for…

Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging

Bangyao Han, Fenglian Sun, Chi Zhang, Xinlei Wang

This paper aims to investigate the effect of the Cu, Ni and Ag addition in Sn5Sb-based alloy on the mechanical properties and its mechanism.

Predictive model of the solder paste stencil printing process by response surface methodology

Chun-Sheng Chen, Hai Wang, Yung-Chin Kao, Po-Jen Lu, Wei-Ren Chen

This paper aims to establish the predictive equations of height, area and volume of printed solder paste during solder paste stencil printing (SPSP) process in surface mount…

Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Lina Syazwana Kamaruzzaman, Yingxin Goh

This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile properties…