Soldering & Surface Mount Technology: Volume 35 Issue 4

Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted

Guisheng Gan, Shi-qi Chen, Liujie Jiang, Cong Liu, Peng Ma, Tian Huang, Dayong Cheng, Xin Liu

This study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints with different bonding temperature under ultrasonic-assisted.

Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact

Soufyane Belhenini, Imad El Fatmi, Caroline Richard, Abdellah Tougui

This study aims to contribute to the numerical modelling of drop impact on a flip-chip component assembled on printed circuit boards using solder micro-bumps. This contribution is…

Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering

Muhammad Asyraf Abdullah, Siti Rabiatull Aisha Idris

Pb-free solders have been developed to replace the standard Sn–Pb eutectic solder since the prohibition on Pb used in solders. The Sn–Ag–Cu series of lead-free solders is the most…

Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures

Wei Lin, Xuewen Li, Bing Tu, Chaohua Zhang, Yulong Li

This study aims to analyze the wettability of the self-developed Sn–Bi–Zn solder and to conduct a series of analysis on the wetting kinetics, diffusion phenomenon and interfacial…

Hot tear cracks on the suppression of Sn–Bi alloy for low-temperature assembly

Songtao Qu, Qingyu Shi

In the electronic assembly industry, low-temperature soldering holds great potential to be used in surface mounting technology. Tin–bismuth (Sn–Bi) eutectic alloys are lead-free…

Drop and impact reliability investigation of BGA and LGA interconnects

Mohammad A. Gharaibeh, James M. Pitarresi

Because of growing demand for slim, thin and cheap handheld devices, reduced-volume solder interconnects like land grid array (LGA) are becoming attractive and popular choices…