Soldering & Surface Mount Technology: Volume 36 Issue 2

Low-cycle fatigue life assessment of SAC solder alloy through a FEM-data driven machine learning approach

Vicente-Segundo Ruiz-Jacinto, Karina-Silvana Gutiérrez-Valverde, Abrahan-Pablo Aslla-Quispe, José-Manuel Burga-Falla, Aldo Alarcón-Sucasaca, Yersi-Luis Huamán-Romaní

This paper aims to present the novel stacked machine learning approach (SMLA) to estimate low-cycle fatigue (LCF) life of SAC305 solder across structural parts. Using the finite…

Temperature and current density prediction in solder joints using artificial neural network method

Yang Liu, Xin Xu, Shiqing Lv, Xuewei Zhao, Yuxiong Xue, Shuye Zhang, Xingji Li, Chaoyang Xing

Due to the miniaturization of electronic devices, the increased current density through solder joints leads to the occurrence of electromigration failure, thereby reducing the…

A 3D coaxial transition with continuous ground wall fabricated by a 12-inch wafer-level packaging method for radio frequency applications

Xinran Zhao, Yingying Pang, Gang Wang, Chenhui Xia, Yuan Yuan, Chengqian Wang

This paper aims to realize the vertical interconnection in 3D radio frequency (RF) circuit by coaxial transitions with broad working bandwidth and small signal loss.

Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints

Rilwan Kayode Apalowo, Mohamad Aizat Abas, Muhamed Abdul Fatah Muhamed Mukhtar, Fakhrozi Che Ani, Mohamad Riduwan Ramli

This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue.

Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications

Rizk Mostafa Shalaby, Mohamed Saad

The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free…

The research on the application of self-propagating interconnection technology in silicon optical transceiver module for aerospace

Fei Chu, Hongzhuan Chen, Zheng Zhou, Changlei Feng, Tao Zhang

This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing

Mohammad A Gharaibeh, Markus Feisst, Jürgen Wilde

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.