Table of contents
The Relationship of Component Solderability Testing to Board‐level Soldering Performance
M.A. Kwoka, P.D. MullenixVisual inspection remains the dominant method of assessing component lead solderability and finished board solder joint quality. In recent years the wetting balance has received…
A Study of the Effects of Infra‐red Reflow Profile on Solder Joint Strength and Structure
T.J. Ennis, N. Brady, B. Keane, A. DonnellyThe effects of varying reflow profiles on the tensile pull strength and structure of solder joints of components with tin plated and nickel‐palladium plated leads were studied. It…
Evaluation and Solderability of Lead‐rich and Eutectic Solder‐coated Component Leads
B.D. Dunn, J.‐P. AndrisiA significant number of integrated circuit (IC) package leads failing solderability tests also had a very thin eutectic solder coating. Poor solderability is attributed to…
Stripping and Replacement of Damaged Solderable Coatings
P.G. Harris, M.A. Whitmore, B. Fairweather, B.D. DunnElectronic materials, particularly tin‐lead coated component leads, may degrade and acquire a poor solderability as a result of long‐term storage or prolonged periods at elevated…
Gold‐Tin Solder Bumps for TAB Inner Lead Bonding with Reduced Bonding Pressure
E. Zakel, J. Simon, G. Azdasht, H. ReichlTape automated bonding (TAB) is a suitable technology for assembling ICs with a high number of l/Os. The gang bonding process usually applied requires increasing thermode forces…
Methodology for Thermal Characterisation of Surface Mount Devices
B.S. SiegalThermal characterisation of surface mount devices (SMDs) has become a growing concern as these components have increased in use—a situation aggravated by the lack of accepted…
Characterising the Corrosion Properties of Flux Residues: Part 2: Test Method Modification
L.J. Turbini, J. Schodorf, J. Jachim, L. Lach, R. Mellitz, F. SleddToday's emphasis on alternative flux technology as an approach to eliminate the use of chlorofluorocarbons (CFCs) requires an understanding of the corrosion potential of the new…
SMART group news
Colin Lea, Bob Willis, Mike Judd, Bob Willis, John Beamish, Karen MooreThis conference was the second in the National Physical Laboratory series focusing in turn on each of the non‐CFC options for de‐fluxing soldered electronics assemblies. The first…
International association news
Brian Richards‘The Joining Environment’ Dates: 14–15 October 1992 Venue: Forte Posthouse, Coventry, England This Conference will provide a venue for discussion on advances in joining…
Industry news
Advanced Monolithic Systems, the Californian based precision voltage reference diode and OP‐amp manufacturer, has given specialist surface mount distributor Flint Distribution a…
New Products
AMI (Affiliated Manufacturers, Inc.) has introduced a new manual vision system for alignment of printed circuit boards to screens or stencils on semi‐automatic screen printers…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang