Table of contents
Editorial
BRUCE INPYNThe Surface Mount Technology Association, SMTA, established in 1984, is a non‐profit, international association of companies and individuals (2700 members) involved in all aspects…
Case Studies in Quality and Reliability Analysis of Fine Pitch Solder Joints
J. Barrett, C.O Mathúna, R. DoyleRapid feedback on the effect of changes in materials or assembly process parameters on solder joint quality is essential in process optimisation for fine pitch surface mount…
The Effect of Adventitious Oxygen on Nitrogen Inerted IR Reflow Soldering with Low Residue Pastes
P.F. Stratton, E. Chang, I. Takenaka, H. Onishi, Y. TsujimotoThe benefits of Nitraclean I nitrogen inerted reflow soldering are well documented. However, there has been some debate as to the maximum oxygen level that can be tolerated by…
Voiding Mechanisms in SMT
W.B. Hance, N.C. LeeThe mechanisms for void formation are investigated for applications involving solder paste in surface mount technology. Generally, voids are caused by the outgassing of entrapped…
The Future of Solder Paste Printing for SMT Reflow Soldering
E.K. Lo, N.N. Ekere, S.H. Mannan, I. IsmailThe use of fine‐pitch SMD devices has increased the need for accurate and consistent solder paste deposits for reflow soldering. Continued miniaturisation in PCB and SMD lead…
Thermal Fatigue Behaviour of Low Melting Point Solder Joints
J. SeyyediAn empirical study was conducted to determine the thermal fatigue behaviour of 1.27 mm pitch, J‐bend and gullwing surface mount solder joints, manufactured with four…
Production Validation of SERA Solderability Test Method
D.M. Tench, M.W. Kendig, D.P. Anderson, D.D. Hillman, G.K. Lucey, T.J. GherThe sequential electrochemical reduction analysis (SERA) method was evaluated in production and demonstrated to provide a non‐destructive, objective measure of the solderability…
A Model Study of Low Residue No‐clean Solder Paste
P.A. Jaeger, N.C. LeeAs one of the major approaches to addressing the CFC issue, no‐clean solder paste has received rapidly increasing attention. Although currently the industry seems to accept full…
Solder Paste for No Clean Reflow
M. FennerThis article describes a low‐cost approach to the search for alternatives to CFC cleaners. In this approach the cleaning and soldering cycles are combined under nitrogen. The…
SMART group news
Colin LeaThis conference, in the series being run by the National Physical Laboratory to help the electronics assembly industry consider the problems of CFC phase‐out, was essentially an…
International association news
Title: BABS One‐day Seminar: ‘Nitrogen or New Soldering Processes’ Date: 21 April 1993 Venue: Institute of Materials, London Title: BABS One‐day Seminar: ‘Challenges for Soldering…
Industry news
Peter Ongley has joined Alpha Metals as Manager of the company's Advanced Products Division. He will be responsible for the technical support and marketing of polymer and…
New Products
In response to increasing concerns about workers' exposure to lead during soldering operations, Dage Intersem have introduced two new formulations of pure tin cored wire…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang