Soldering & Surface Mount Technology: Volume 6 Issue 1

Process Yield and Reliability of 0.65 mm Pitch Technology in Surface Mounting

J. Liu

This paper describes the influence of soldering parameters on solder joint quality and reliability of 0.65 mm pitch QFP technology. Soldering process parameters such as soldering…

Study of the Corrosivity of Solder Pastes

J. Guinet, X. Lambert, D. Bono

The corrosive power of solder pastes is studied by implementing a new method compatible with the common rules of use. The entire methodology is fully described. The results show…

Quality Optimisation of Fine Pitch Surface Mount Solder Joints using Taguchi Experimental Design Techniques

T. Yamada, J. Barrett, R. Doyle, A. Boetti

The use of Taguchi experimental design techniques to examine the effects of package type, solder paste type and solder reflow technique on the quality of fine pitch surface mount…

Solder Paste Dispensing in Robotic SMD Rework

N. Geren, N.N. Ekere

Although rework is labour intensive and conflicts with most modern manufacturing/assembly philosophies, realistic defect levels in surface mount technology (SMT) printed circuit…

Important Issues in Reflow Soldering

F.J. de Klein

For reflow soldering in today's changing component and soldering technology, requirements with respect to profiling seem to be difficult to determine and even harder to meet…

Life Prediction of SMT Solder Joints under Thermal Cycling

J.H. Huang, J.Y. Pei, Y.Y. Qian, Y.H. Jiang

In this paper, a formula for life prediction of SMT solder joints under thermal cycling has been established on a damage model. The major failure mechanisms such as fatigue, creep…

Reliability of 0.4 mm Pitch, 256‐pin Plastic Quad Flat Pack No‐clean and Water‐clean Solder Joints

J. Lau, Y.‐H. Pao, C. Larner, R. Govila, S. Twerefour, D. Gilbert, S. Erasmus, S. Dolot

The reliability of 0.4 mm pitch, 28 mm body size, 256‐pin plastic quad flat pack (QFP) no‐clean and water‐clean solder joints has been studied by temperature cycling and…

Erratum

This article has been withdrawn as it was published elsewhere and accidentally duplicated. The original article can be seen here: 10.1108/eb046243. When citing the article, please…

SMART news

Michael Fenner, Norman Hodson

Every electronics manufacturing company wants to know how effective its process is compared with industry leaders; to date this has not been possible. From an initial concept by…

International association news

Paul Harris

There can have been few periods in the history of the electronics soldering industry when the introduction of new technologies was so widespread and prevalent. Many of these…

Industry news

SMTech of Dorchester have appointed Ian Belchamber to the newly created position of Vision Applications Engineer. He will head SMTech's Vision Technology Unit and will design…

New Products

Fry's Metals have introduced a water‐soluble wavesoldering flux to meet the revised MIL‐F‐14256 specification, for board manufacturers using aqueous cleaning processes.