Table of contents
Build Cycle Time Reduction through Process Optimisation*
H. ValladaresSince establishing a low volume, high reliability surface mount technology(SMT) facility, a number of problems have been overcome as part of the learningexperience. The tailoring…
Capillary Flow Solder Wettability Test*
P.T. Vianco, J.A. RejentA test procedure was developed to assess the capillary flow wettability of soldersinside a confined geometry. The test geometry comprised two parallel plates with a controlledgap…
Closed Loop Control of Atmospheres for Soldering
N. Saxena, C. Precious, A. Carr, S. AdamsWell designed stable reflow ovens andwave machines can be operated at low rates of the inerting gas. One problem is that at the lowestflow rate settings changes in room draughts…
Some Problems in Switching to Lead‐free Solders*
W.B. HampshireThe electronics industry seems to be under slightly less pressure, at present, to move to lead‐freesolders. Nevertheless, many companies are interested in switching to comply with…
Heated Gas Jet Reflow: An Alternative Reflow Solder Assembly Process Technology*
L.R. Lichtenberg, P.J. GillespieA new product design required the addition of a secondlayer of electronics to control a base module. This product was designed with significantoverhangs of heavy leads and…
Mass Soldering
G. BeckerThis issue of thejournal features the final part of a two‐part series which comprises Chapter 15 fromVolume 1 of a recently published book ‘A Comprehensive Guide to the…
Microstructurally Based Finite Element Simulation on Solder Joint Behaviour*
D.R. Frear, S.N. Burchett, M.K. Neilsen, J.J. StephensThe most commonly used solder for electricalinterconnects in electronic packages is the near eutectic 60Sn‐40Pb alloy. This alloy hasa number of processing advantages(suitable…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang