Table of contents
Energy‐recovery low power C‐PAL flip‐flop design
H.H. Wong, K.T. LauBesides combinational circuits, sequential circuits, for instance, flip‐flops, also play an important role in the design of digital systems. In this article…
Investigations of assembly properties of conductive layers in LTCC circuits
A. Bochenek, B. Bober, A. Dziedzic, L. GolonkaInvestigations were aimed at evaluation of assembly properties of conductive layers cofired with LTCC substrates. The usefulness of these layers for low‐temperature soldering…
Effects of the pre‐neutron irradiation on VDMOSFET sensitivity to heavy ions
C. Salame, A. Hoffmann, F. Pelanchon, P. Mialhe, J.P. CharlesThis article shows that irradiation with neutrons can be used as solution to harden commercial (COTS: Commercial‐Off‐The‐Shelf) n‐channel power MOSFET (Metal Oxide Semiconductor…
Measurement techniques for the evaluation of thick‐film materials used in wireless applications
Zhengrong Tian, Charles FreeA review of the dielectric measurement techniques that are currently available for the characterization of thick film and LTCC materials at microwave and millimeter wave…
An investigation of the factors influencing stability in continuously‐powered screen‐printed amperometric dissolved oxygen sensors
J.K. Atkinson, W.V. GlasspoolThe continuously powered response of dissolved oxygen sensors fabricated as screen printed devices has been investigated. A reduction in the sensitivity of these devices has been…
The use of thick print copper and silver conductors for power applications
David K. Anderson, John Oleksyn, Martin Batson, John CockerThick printing Cu and Ag conductors have been developed specifically for use in power applications where excellent printing, thermal, electrical, wire bonding and soldering…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson