Table of contents
Editorial
Keith Johnson, Brian WaterfieldInterconnection, packaging and mounting of electronic devices tend to be too often neglected in development of the increasingly sophisticated devices of today. Whilst the…
Parameters Affecting the Incidence of Pad Bridging in Surface Mounted Device Attachment
B.L. Roos‐KozelThe chip carrier industry and the mounting of chip carriers with solder paste are growing rapidly. Recent papers have covered the advantages of increased board density and design…
VLSI Packaging
H. ReinerThe ever greater complexity of VLSI devices is resulting in increases in pin count, power dissipation, and chip area. Furthermore, the increase in speed because of the smaller…
Packaging of Dot‐matrix Electroluminescent Display Module
A. Aintila, E. JärvinenDemanding technical requirements of thin film electroluminescent display modules and hard competition in electronic display markets set boundaries for the setting of goals in the…
Resistor Chips for Thick Film Hybrids
H. Diletti, R. Hoffmann, G. Sele, J. ReesApplications for thin film resistor chips in thick film hybrid circuits are discussed in relation to the different technologies involved, namely naked and encapsulated forms of…
Solderable Polymer Thick Film Conductors for Surface Mount Technology
F. St. JohnA new class of solderable PTF materials has been evaluated for SMDs on FR‐4 substrates. No etching or plating baths are required in this totally additive process. The materials…
Functional Trimming
P. ThompsonWith increased application of hybrids, methods have been developed enabling resistor films to be cut away until the resistor has precisely the required value for correct…
Polymer Thick Film Circuits in Japan
A. Kabe, I. MorookaPolymer thick film circuits have been used in consumer appliances, a trend that is growing as one of the major technologies in Japan in this field. This paper discloses the state…
Surface Mount Technology Setting Up a Surface Mount Facility
G.L. RoweThis paper presents the manufacturing methods used in the assembly of electronic circuits with surface mount components on planar printed wiring circuits. The manufacturing…
Creating Mechanical Stress in the Resistive Layer as a Method of Studying its Temperature Characteristics
D. Szymański, S. Achmatowicz, J. Bekisz, B. SzczytkoThe separation of thick‐film resistor temperature characteristics into two components is presented. One of the components is a function of the resistive material, the other a…
Glass‐ceramic Coated Metal Substrates
R.W. JonesA historical review of the development of metal‐cored substrates is given, together with a detailed account of glass‐ceramic coated metal substrates as currently manufactured by…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson