Table of contents
Modelling and wave velocity calculation of multilayer structure SAW sensors
Dejan V. Tošić, Marija F. HribšekThe purpose of this paper is to model multilayer structure surface acoustic wave (SAW) sensors, incorporated in CMOS or micro‐electro‐mechanical system integrated circuits, and to…
Overview and outlook of through‐silicon via (TSV) and 3D integrations
John H. LauThe purpose of this paper is to focus on through‐silicon via (TSV), with a new concept that every chip or interposer could have two surfaces with circuits. Emphasis is placed on…
Testing on dynamic behavior of PBGA assembly by considering fixed‐modes
Ping Yang, Zixia ChenThe purpose of this paper is to develop a systematic experimental investigation for testing dynamic behavior of plastic ball grid array (PBGA) integrity in electronic packaging…
DC magnetron sputter‐deposited tungsten silicide films for microelectronic applications
Jian‐Wei Hoon, Kah‐Yoong Chan, Teck‐Yong TouThe purpose of this paper is to share valuable information about metallization in microelectronic industries by implementing tungsten silicide (WSi) thin film materials.
Stabilization network optimization of internally matched GaN HEMTs
W.J. Luo, X.J. Chen, C.Y. Yang, Y.K. Zheng, K. Wei, X.Y. LiuThe purpose of this paper is to report on the stabilization network optimization of internally matched GaN high electron mobility transistors (HEMTs).
A low‐power CMOS DC‐DC buck converter with on‐chip stacked spiral inductor
Chan‐Soo Lee, Ho‐Yong Choi, Yeong‐Seuk Kim, Nam‐Soo KimThe purpose of this paper is to present a fully integrated power converter. A stacked spiral inductor is applied in a voltage‐mode CMOS DC‐DC converter for the chip…
X‐ray diffraction studies of AlxGa1−xN (0≤x≤1) ternary alloys grown on sapphire substrate
Ng Sha Shiong, Ching Chin Guan, Zainuriah Hassan, Haslan Abu HassanThe purpose of this paper is to report the structural properties of AlxGa1−xN (0≤x≤1) grown on sapphire substrate by means of X‐ray diffraction (XRD) technique. The main purpose…
An investigation into the effect of fabrication parameter variation on the characteristics of screen‐printed thick‐film silver/silver chloride reference electrodes
J.K. Atkinson, M. Glanc, P. Boltryk, M. Sophocleous, E. Garcia‐BreijoThe purpose of this paper is to show how the fabrication parameters of screen‐printed thick‐film reference electrodes have been experimentally varied and their effect on device…
Response of Ag thick film microstrip straight resonator to perturbation of bulk and thick film Ni(1−x)CuxMn2O4 (0≤x≤1) ceramics
R.N. Jadhav, Vijaya PuriThe purpose of this paper is to describe the use of copper‐substituted nickel manganite thick film and bulk ceramic superstrate on Ag thick film microstrip straight resonator…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson