Microelectronics International: Volume 30 Issue 3

Design of low‐noise CMOS transimpedance amplifier

The purpose of this paper is to design a very low‐noise transimpedance amplifier (TIA) for a novel multi‐pixel CMOS photon detector which performs secondary electron (SE…

Three axial low temperature cofired ceramic accelerometer

The paper aims to present numerical modeling and technology of a very first three axial low temperature cofired ceramics (LTCC) accelerometer.

Study of frequency dependent electrical properties of ZnO nanorods

The purpose of the current research is to use impedance spectroscopy to study the AC parameters that varied with frequency such as impedance, dielectric constant and conductivity…

Study on the fluid‐structure interaction of flexible printed circuit board motherboard in personal computer casings

The flexible printed circuit board (FPCB) can be an alternative to the rigid printed circuit board because of its excellent flexibility, twistability, and light weight. Using FPCB…

Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey‐based Taguchi method

Reflow soldering is one of the most significant factors in determining solder joint defect rate. This study aims to introduce an innovative approach for optimizing the multiple…

Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array

The purpose of this paper is to provide a systematic method to perform long‐term reliability assessment of gold (Au) and copper (Cu) ball bonds in fineline ball grid array…

Tin contamination in PQFN package and its effects on wire bondability

The purpose of this paper was to attempt to confirm the root cause of unstable stitch pull strength in PQFN package and propose some permanent solutions for it.

Multitest deploys aPriori product cost management platform

IMAPS UK elects officers at their AGM

Monitoring changes in vibrational energy to provide competitive advantage with self-powered sensors and systems

Semikron checks DCBs with automatic wirebond AOI from Viscom

High accuracy, low power digital temperature sensor from measurement specialties

GLOBALFOUNDRIES and Samsung support New Cadence Virtuoso advanced node for 20 and 14 nm processes

ARM and Synopsys collaborate to deliver optimised reference implementations for ARM processors

India’s Government in talks to set up chip fabrication units

System on Package Research – Atotech collaborates with Georgia Tech Packaging Research Center

MicroTech 2013 IMAPS-UK Annual Conference TWI, Granta Park, Abington, Cambridge, 21 March 2013

Qualcomm Snapdragon 800 processor first to use TSMC’s 28HPM advanced process technology

International diary

AIM Solder receives Environmental ISO 14001:2004 certification