Table of contents
Multichip Technology—Something for everyone?
Jack BaldeEach of the three major branches of interconnection technology has begun to focus its attention on Multichip Modules. The semiconductor manufacturers call the technology ‘The New…
Solid State Physics—1947
J. BardeenThis article was part of a commemorative section in Solid State Technology entitled ‘The Transistor—The First Forty Years’, which celebrated the 40th anniversary of the December…
Thermal Studies on Hybrid Circuits
G. De Mey, L. Rottiers, M. Driscart, E. Boone, L. Van SchoorIn this paper the temperature distribution in hybrid circuits will be studied in two different ways. First of all the results of numerical simulations obtained with the programs…
Eliminating Electronic Component Stresses through Controlled Laser Soldering
R. Vanzetti, A.C. TraubA procedure is discussed wherein an infra‐red detector is used for controlling the quality of solder joints being formed by laser‐beam heating on printed circuit boards while, at…
CMOS Gate Array Design
J.M. McGrailSoftware tools are an essential part of any IC design system but there are dangers associated with the introduction of CAD systems. This paper attempts to lift the software cloak…
Photoconductivity of Thick Film Resistors
G.B. Parravicini, G. Samoggia, B. Morten, M. PrudenziatiA weak change of resistivity caused by visible radiation both for commercial and for model thick‐film (cermet) resistors (TFRs) has been observed and studied in the temperature…
Analysis and Synthesis of Thick Film Resistors Using EGET Principles
O.S. Aleksić, P.M. Nikolić, D.M. TodorovićA new model for thick film resistor calculation accounts for the physical effects which make variations in local sheet resistivity and local volume resistivity: geometry and…
Economic Justification For Hybrid Substrate Testing
D.F. CrowleyThis paper focuses on the economic justification for testing unpopulated hybrid substrates. The return on investment (ROI) for substrate testing is based on the high value added…
Thick Film Resistors Not Only on Ceramics: How to Obtain Suitable Layout Parameters
G. StecherThe square resistance of thick film resistors on dielectric layers can show a very complex behaviour. From resistance measurements of a test pattern three suitable paste…
Plating of Ceramic Components for Surface Mounting Assembly
D.A. LukeTo permit multilayer ceramic capacitors to be soldered directly onto printed circuit boards and other components, the terminations are plated with a barrier layer (usually nickel…
Thermal Design Considerations for COB Applications
R.C. EstesAs requirements for system performance and density increase, more attention is being given to chip‐on‐board (COB) packaging techniques. COB is ‘surface mount packaging taken to…
Abruzzo, Italy
R.B. TurnbullTerminal 1 at London's Heathrow Airport is not one of my favourite rendezvous locations, especially before 8.00 a.m. on a Sunday morning. However, Sunday 5th June was an…
Company profile
R.B. TurnbullWe continued our brief visit to Germany with an easy day's drive through the Black Forest to Eastern Bavaria. From a good vantage point one could see the distant Alps with their…
SMT/ASIC 88, Sindelfingen
Lorna CullenMention Sindelfingen to anyone involved in the electronics industry and they spontaneously refer to IBM, who have a major presence in the Sindelfingen/Böblingen area. To many…
Electronic Packaging in Japan
J. WheelerWe hear much about the Japanese and their dominant position in electronics. Attention is focused on their superior production techniques, automation, high reliability and low…
ISHM news
J. Lantaires, G. Forster, M.S. Setty, Nihal SinnaduraiThe venue for this year's ISHM‐Benelux Autumn Conference and ‘table‐top’ display meeting on 12 October will be the Institut Supérieur Industriel de l'Etat, Mons, Belgium.
Industry news
Richard Tait, R.B. TurnbullKulicke and Soffa Industries, Inc. have announced the appointment of Dr Arthur J. Schneider as Vice President of Research and Development. Dr Schneider is based in Willow Grove…
New products
Du Pont have introduced a new family of thick film materials, developed to meet the needs of the hybrid microcircuit industry for higher density circuits, improved reliability and…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson